Patent classifications
A61B1/0011
IMAGING MODULE, ENDOSCOPE SYSTEM, AND IMAGING MODULE MANUFACTURING METHOD
An imaging module includes an imager having an optical member on a light receiving surface, an electronic component having a front surface facing the same direction as the one to which an incidence surface of the optical member faces, a resin portion that has a first surface flush with the incidence surface of the optical member and the front surface of the electronic component, and a second surface that is a surface on a side opposite to the first surface while having the imager and the electronic component being embedded therein such that the incidence surface and the front surface are exposed to the first surface, an external connection terminal provided on the second surface, and a through wiring that extends through the resin portion to connect at least one of the imager and the electronic component with the external connection terminal.
Endoscope device and cable assembly thereof
An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.
FLEXIBLE ELECTRONIC CIRCUIT BOARD FOR A MULTI-CAMERA ENDOSCOPE
There is provided herein a flexible electronic circuit board for a tip section of a multi-camera endoscope, the circuit board comprising a front camera surface configured to carry a forward looking camera, a first side camera surface configured to carry a first side looking camera, a second side camera surface configured to carry a second side looking camera, one or more front illuminator surfaces a configured to carry one or more front illuminators to essentially illuminate the FOV of the forward looking camera, one or more side illuminator surfaces configured to carry one or more side illuminators to essentially illuminate the FOV of the first side looking camera and one or more side illuminator surfaces configured to carry one or more side illuminators to essentially illuminate the FOV of the second side looking camera.
LIGHT-GUIDING STRUCTURE, ENDOSCOPE TIP, AND METHOD FOR MANUFACTURING A LIGHT-GUIDING STRUCTURE
A light-guiding structure according to the invention is used in an endoscope for guiding light along a lengthwise direction and includes a first portion and a second portion. The first portion extends in a single cross section along the lengthwise direction. The second portion extends in a varying cross section along the lengthwise direction and is connected to an end of the first portion in the lengthwise direction. An endoscope tip includes a circuit board, an image-capturing component, a light-emitting component, and the light-guiding structure. The light-guiding structure can fit the contours of the circuit board and the image-capturing component to increase space usage for obtaining more cross-sectional area. For the production of the light-guiding structure, the second portion is formed by shaping a portion directly extending form the end of the first portion or by an additional material directly bonded to the end of the first portion by molding.
Embeddable Module for High Output Led
In one aspect, a light module is disclosed, which includes a housing providing a hollow chamber extending from a proximal end to a distal end, and a lens positioned in the hollow chamber, where the lens has a lens body comprising an input surface for receiving light from a light source and an output surface through which light exits the lens body, said lens further comprising a collar at least partially encircling said lens body. The light module further includes at least one shoulder on which the lens collar can be seated for positioning the lens within the housing. A light source, e.g., an LED, is coupled to the hollow chamber, e.g., at its proximal end, for providing light to the lens. In some embodiments, an optical window is disposed in the hollow chamber and is optically coupled to the output surface of the lens such that the light exiting the lens passes through the optical window before exiting the light module. In some embodiments, the shoulder can be formed as part of the housing. In other embodiments, the shoulder can be provided by a sleeve disposed in the module's housing.
METHOD OF MAKING DIVERGING-LIGHT FIBER OPTICS ILLUMINATION DELIVERY SYSTEM
A process of making a diverging-light fiber optics illumination delivery system includes providing a micro-post comprising a glass-ceramic light-scattering element that includes at least one of a ceramic, a glass ceramic, an immiscible glass, a porous glass, opal glass, amorphous glass, an aerated glass, and a nanostructured glass; and fusion-splicing the glass-ceramic micro-post to the optical fiber by pulling an arc between electrodes across a gap formed by the optical fiber and the glass-ceramic micro-post; maintaining the arc for a time sufficiently long to make facing surfaces of the optical fiber and the micro-post one of malleable and molten; and pushing and thereby fusing together the facing surfaces of the optical fiber and the micro-post. Some embodiments can include fusing the glass-ceramic micro-post to the optical fiber by applying a laser beam to heat up at least one of the facing surfaces of the optical fiber and the glass-ceramic micro-post.
IMAGE PICKUP APPARATUS, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PICKUP APPARATUS
An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.
ENDOSCOPE HANDLE WITH FRAME
An endoscope having a handle, the handle including a frame with bearings, a control device with trunnions extending from opposite sides of a body of the control device, shell parts together enclosing a cavity accommodating the frame and at least partly the control device therein, the shell parts including a first column and a second column extending into the cavity from opposite sides, wherein the shell parts and the frame each are formed as separate components, wherein the trunnions of the control device and preferably the columns are supported by the bearings of the frame so that the control device is rotatable about a pivot axis, and wherein the first and second columns of the shell parts are arranged to retain the trunnions of the control device between the first and second columns of the shell parts.
ELECTRONIC MODULE, METHOD OF MANUFACTURING ELECTRONIC MODULE, AND ENDOSCOPE
An electronic module includes: an integrated circuit including a first mounting surface; a solid wiring board including a second mounting surface and a third mounting surface within a horizontally projected area corresponding to the integrated circuit; both the second and third mounting surfaces face the first mounting surface of the integrated circuit and disposed at positions with different distances to the first mounting surface. An electrode surface of an electronic component mounted in a space formed between the first and the third mounting surfaces, and an electrode surface of the second mounting surface are arranged substantially parallel to a surface of the integrated circuit on which electrodes are aligned. The electrode on the second mounting surface and the electrodes of the integrated circuit are electrically connected to each other. The electrode of the electronic component is electrically connected to the electronic component and the electrodes of the integrated circuit.
SUBASSEMBLY, OBJECTIVE AND LONG THING OPTICAL IMAGE TRANSFER SYSTEM
The invention relates to a subassembly (1) for an objective (10), in particular for a long and slim optical image transmission system, for example an endoscope, an objective (10) and an optical image transmission system, as well as methods for manufacturing a subassembly and an objective. The subassembly (1) comprises a prism (2) and an aperture element (3), wherein the prism (2) and the aperture element (3) are fixedly connected to each other, preferably by means of a putty or via direct bonding.