The present invention relates to the field of organic synthesis and more specifically it concerns a novel compound of formula (I). The invention additionally relates to a process for preparing a compound of formula (III) using the compound of formula (I) as an intermediate, wherein the process involves elimination of the R3(X)nC(O)O functional group of the compound of formula (I).

The present invention relates to the field of organic synthesis and more specifically it concerns a novel compound of formula (I). The invention additionally relates to a process for preparing a compound of formula (III) using the compound of formula (I) as an intermediate, wherein the process involves elimination of the R3(X)nC(O)O functional group of the compound of formula (I).

A method for separating a mixture of materials A and B by extractive distillation, using an extraction medium having a higher affinity to B than to A, collecting a liquid fraction on a collecting tray and heated and partially evaporated in a first indirect heat exchanger, collecting the resultant vapor is released into the column and a non-evaporated proportion of the liquid fraction in the sump of the column, and a series of heating, separation and cooling where partially cooled extraction medium fraction is used as heating medium for a heat exchanger.

A method for separating a mixture of materials A and B by extractive distillation, using an extraction medium having a higher affinity to B than to A, collecting a liquid fraction on a collecting tray and heated and partially evaporated in a first indirect heat exchanger, collecting the resultant vapor is released into the column and a non-evaporated proportion of the liquid fraction in the sump of the column, and a series of heating, separation and cooling where partially cooled extraction medium fraction is used as heating medium for a heat exchanger.

The present invention relates to a method for preparing acetate compounds using ketene.

The present invention relates to a method for preparing acetate compounds using ketene.

The present disclosure is directed to methods of purifying solvents. The purified solvents can be used for cleaning a semiconductor substrate in a multistep semiconductor manufacturing process.

The present disclosure is directed to methods of purifying solvents. The purified solvents can be used for cleaning a semiconductor substrate in a multistep semiconductor manufacturing process.

A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the composition, and a crack-free silica-based coating film formed using the composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the composition, and a crack-free silica-based coating film formed using the composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.