C07C323/19

Resin and Method for Preparing Same

Provided are a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition,

##STR00001## wherein all the variables are described herein.

Resin and Method for Preparing Same

Provided are a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition,

##STR00001## wherein all the variables are described herein.

PICOLINAMIDES AS FUNGICIDES

This disclosure relates to picolinamides of Formula I and their use as fungicides.

##STR00001##

PICOLINAMIDES AS FUNGICIDES

This disclosure relates to picolinamides of Formula I and their use as fungicides.

##STR00001##

PICOLINAMIDES AS FUNGICIDES

This disclosure relates to picolinamides of Formula I and their use as fungicides.

##STR00001##

PICOLINAMIDES AS FUNGICIDES

This disclosure relates to picolinamides of Formula I and their use as fungicides.

##STR00001##

Resin and Method for Manufacturing Same

A resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition are described:

##STR00001##

wherein all variables are described herein.

Resin and Method for Manufacturing Same

A resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition are described:

##STR00001##

wherein all variables are described herein.

COMPOSITION FOR DISPLAY SEALING MATERIAL, ORGANIC PROTECTION LAYER COMPRISING SAME, AND DISPLAY DEVICE COMPRISING SAME
20170342172 · 2017-11-30 ·

A display sealing material composition includes a photopolymerization initiator and a photocuring monomer, the photocuring monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups. An organic protection layer obtained by curing the composition for a display sealing material has approximately 400 nm/min or less plasma etching rate being represented by formula 1 below and approximately 2 nm or less surface roughness.


Plasma etching rate(nm/min)=(T0T1)/M,<Formula 1>

wherein T0, T1, and M are set forth in the specification.

Sulfonate-based compound and method for preparing same

The present application relates to a sulfonate-based compound and a method for preparing the same.