Patent classifications
C07C323/19
Resin and Method for Preparing Same
Provided are a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition,
##STR00001## wherein all the variables are described herein.
Resin and Method for Preparing Same
Provided are a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition,
##STR00001## wherein all the variables are described herein.
PICOLINAMIDES AS FUNGICIDES
This disclosure relates to picolinamides of Formula I and their use as fungicides.
##STR00001##
PICOLINAMIDES AS FUNGICIDES
This disclosure relates to picolinamides of Formula I and their use as fungicides.
##STR00001##
PICOLINAMIDES AS FUNGICIDES
This disclosure relates to picolinamides of Formula I and their use as fungicides.
##STR00001##
PICOLINAMIDES AS FUNGICIDES
This disclosure relates to picolinamides of Formula I and their use as fungicides.
##STR00001##
Resin and Method for Manufacturing Same
A resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition are described:
##STR00001##
wherein all variables are described herein.
Resin and Method for Manufacturing Same
A resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition are described:
##STR00001##
wherein all variables are described herein.
COMPOSITION FOR DISPLAY SEALING MATERIAL, ORGANIC PROTECTION LAYER COMPRISING SAME, AND DISPLAY DEVICE COMPRISING SAME
A display sealing material composition includes a photopolymerization initiator and a photocuring monomer, the photocuring monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups. An organic protection layer obtained by curing the composition for a display sealing material has approximately 400 nm/min or less plasma etching rate being represented by formula 1 below and approximately 2 nm or less surface roughness.
Plasma etching rate(nm/min)=(T0T1)/M,<Formula 1>
wherein T0, T1, and M are set forth in the specification.
Sulfonate-based compound and method for preparing same
The present application relates to a sulfonate-based compound and a method for preparing the same.