A curable system containing a benzoxazine and a benzothiazole sulfenamide. The curable system may be catalyzed at temperatures generally used to cure multifunctional epoxy resins yet exhibits improved pot-life and processing times and provides a cured article that exhibits acceptable thermo mechanical properties.

The present invention relates to a novel spiroquinone derivative compound, a production method thereof, and a pharmaceutical composition for preventing or treating neurological disorders which contains the compound as an active ingredient.

The present invention relates to a novel spiroquinone derivative compound, a production method thereof, and a pharmaceutical composition for preventing or treating neurological disorders which contains the compound as an active ingredient.

The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.

The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

The present disclosure provides a curable system containing a benzoxazine and a benzothiazole sulfenamide. The curable system may be catalyzed at temperatures generally used to cure multifunctional epoxy resins yet exhibits improved pot-life and processing times and provides a cured article that exhibits acceptable thermo mechanical properties.

The present disclosure provides a curable system containing a benzoxazine and a benzothiazole sulfenamide. The curable system may be catalyzed at temperatures generally used to cure multifunctional epoxy resins yet exhibits improved pot-life and processing times and provides a cured article that exhibits acceptable thermo mechanical properties.

This disclosure relates to a curable composition that includes at least one maleimide-containing compound or benzoxazine compound, at least one low dielectric loss polymer or a hydrogenated derivative thereof, at least one filler, and at least one radical initiator. This disclosure also relates to using the composition to form a film, a laminate, and/or a circuit board.