Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (CSPs), ball grid arrays (BGAs), land grid arrays (LGAs) and the like (collectively, subcomponents), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (CSPs), ball grid arrays (BGAs), land grid arrays (LGAs) and the like (collectively, subcomponents), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

The present invention relates to compound of formula (I), wherein R.sup.1 is chloro, bromo iodo or a brosylate group. The present invention also relates to methods of making this compound and its use in carrying out organic transformations. ##STR00001##

The present invention relates to compound of formula (I), wherein R.sup.1 is chloro, bromo iodo or a brosylate group. The present invention also relates to methods of making this compound and its use in carrying out organic transformations. ##STR00001##

The present disclosure relates to the field of epoxide resin, and more particularly to an epoxide with a low total chlorine content and no heavy metal residues, and a preparation method thereof. Disclosed is an epoxide prepared from raw materials including an unsaturated cycloaliphatic compound containing a double bond, hydrogen peroxide, an organic acid compound, a solvent and an alkaline salt; wherein a molar ratio of the organic acid compound to the unsaturated cycloaliphatic compound containing a double bond is (1-1.5):1. The obtained epoxides obtained in the present disclosure have a high purity, a high yield, a low solvent content, low chroma, and a low chlorine and metal ion content; the reaction system is simple, environmentally friendly, safe and controllable, and the production cost is low, which can meet the technical and economic requirements and are suitable for large-scale industrial production.

The present invention provides processes for preparing a prostacyclin analog of Formula I ##STR00001##
or a pharmaceutically acceptable salt thereof, wherein R.sup.10 is a linear or branched C.sub.1-6 alkyl. The processes of the present invention comprise steps that generate improved yields and fewer byproducts than traditional methods. The processes of the present invention employ reagents (e.g., the oxidizing reagent) that are less toxic that those used in the traditional methods (e.g., oxalyl chloride). Many of the processes of the present invention generate intermediates with improved e.e. and chemical purity; thereby eliminating the need of additional chromatography steps. And, the processes of the present invention are scalable to generate commercial quantities of the final compound.

The present invention provides processes for preparing a prostacyclin analog of Formula I ##STR00001##
or a pharmaceutically acceptable salt thereof, wherein R.sup.10 is a linear or branched C.sub.1-6 alkyl. The processes of the present invention comprise steps that generate improved yields and fewer byproducts than traditional methods. The processes of the present invention employ reagents (e.g., the oxidizing reagent) that are less toxic that those used in the traditional methods (e.g., oxalyl chloride). Many of the processes of the present invention generate intermediates with improved e.e. and chemical purity; thereby eliminating the need of additional chromatography steps. And, the processes of the present invention are scalable to generate commercial quantities of the final compound.

Provided are a glycidyl (meth)acrylate composition, which includes a phenolic polymerization inhibitor that is unlikely to deteriorate such that the glycidyl (meth)acrylate composition can be stably stored for a long period of time, and a method for suppressing deactivation of a phenolic polymerization inhibitor in a glycidyl (meth)acrylate resin composition. More specifically, provided are: a glycidyl (meth)acrylate composition including a glycidyl (meth)acrylate, a quaternary ammonium salt, and a phenolic polymerization inhibitor, wherein a content of the quaternary ammonium salt is 1.00 ppm or less; and a method for suppressing deactivation of a phenolic polymerization inhibitor in a glycidyl (meth)acrylate composition, including adjusting a content of a quaternary ammonium salt in the glycidyl (meth)acrylate composition to 1.00 ppm or less.

Provided are a glycidyl (meth)acrylate composition, which includes a phenolic polymerization inhibitor that is unlikely to deteriorate such that the glycidyl (meth)acrylate composition can be stably stored for a long period of time, and a method for suppressing deactivation of a phenolic polymerization inhibitor in a glycidyl (meth)acrylate resin composition. More specifically, provided are: a glycidyl (meth)acrylate composition including a glycidyl (meth)acrylate, a quaternary ammonium salt, and a phenolic polymerization inhibitor, wherein a content of the quaternary ammonium salt is 1.00 ppm or less; and a method for suppressing deactivation of a phenolic polymerization inhibitor in a glycidyl (meth)acrylate composition, including adjusting a content of a quaternary ammonium salt in the glycidyl (meth)acrylate composition to 1.00 ppm or less.

Provided is a resin composition for a solid polymer fuel cell sealing material, the resin composition including a copolymer resin having a weight average molecular weight of 150,000 or more and formed by copolymerizing raw material components including: (a1) 5% by mass or more of styrene; and (b) 20% by mass or less of glycidyl (meth)acrylate. Preferably, the raw material components are configured to further include (c) one or more kinds of other polymerizable monomers selected from a hydroxyalkyl (meth)acrylate and an alkyl (meth)acrylate.