A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

An object of the present invention is to provide a photosensitive resin composition having good liquid repellency. The photosensitive resin composition of the present invention at least contains a fluororesin having a crosslinking site, a solvent, and a photopolymerization initiator, and the fluororesin contains a repeating unit derived from a hydrocarbon having a fluorine atom.

An object of the present invention is to provide a photosensitive resin composition having good liquid repellency. The photosensitive resin composition of the present invention at least contains a fluororesin having a crosslinking site, a solvent, and a photopolymerization initiator, and the fluororesin contains a repeating unit derived from a hydrocarbon having a fluorine atom.

A block copolymer is provided that includes a first block having pendant phosphorus-containing groups and a second block having fluorinated groups. Compositions containing the block copolymer as well as articles that include the block copolymer are also provided. The block copolymer can be used to provide a lower surface energy to a surface, particularly a metal-containing surface.

The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.

An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:

##STR00001##

wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.

The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.

An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used:

##STR00001##

wherein one of R.sub.1 and R.sub.2 is a (meth)acryloyloxy group, the other of R.sub.1 and R.sub.2 is a hydrogen atom, R.sub.3 to R.sub.20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R.sub.8 binds and a carbon atom to which R.sub.9 binds together form a double bond.

Antimicrobial polymer composite materials are disclosed that are suitable for making oral devices used in dental applications, such as denture bases. Acrylic resin composite materials comprising antimicrobial polymers and antimicrobial fillers provide reduction in common oral microorganisms after long-term aging, with reduced release rate of antimicrobial agents from the composite material. Antimicrobial polymers are prepared from compositions comprising acrylate and/or methacrylate monomers and polymerizable quaternary ammonium silicon-containing compounds.

An apparatus and methods for using coatings for metal applications are disclosed. According to one embodiment, an article comprises a cured polymeric film having a first reaction product of a cationic photoinitiator and a compound suitable for cationic polymerization. The article has a second reaction product of a free-radical photoinitiator and a compound suitable for free-radical polymerization; The article has a metal substrate, wherein the cured polymeric film coats the metal substrate.

The present invention provides a dibutylfluorenyl derivative, an application of same as a photoinitiator, and a preparation method therefor. The present invention provides a photocuring composition including the compound and a photocuring method using the composition.

According to various embodiments of the present disclosure, a composition includes about 5 to about 40 parts by weight of a solute copolymer component. The solute component optionally has one T.sub.g or T.sub.m of at least 25° C. The composition further includes about 60 to about 95 parts by weight of a solvent monomer. The solvent monomer component includes (meth)acrylate monomers and a multifunctional acrylate. The sum of the solute copolymer component and the solvent monomer component is 100 parts by weight. The composition further includes about 5 to about 100 parts of a plasticizer, relative to the 100 parts.