C08F22/24

COMPOUND CONTAINING MESOGENIC GROUP, AND MIXTURE, COMPOSITION, AND OPTICALLY ANISOTROPIC BODY USING SAID COMPOUND

There is provided a compound containing a mesogenic group, which includes a silicon compound at a low concentration, a polymerizable compound containing the mesogenic group, a mixture and a composition using these compounds, a polymerizable mixture having the polymerizable compound, and a polymer, an optically anisotropic body, and a phase difference film using the polymerizable composition. It is possible to obtain the optically anisotropic body and the phase difference film having satisfactory scratch resistance and adhesion, by using the polymerizable composition composed of the compound containing a mesogenic group, which includes a silicon compound at a low concentration.

(Meth)acrylate and use thereof
12441821 · 2025-10-14 · ·

It is an object of the present invention to provide a monomer which can provide a cured product having both high toughness and rigidity. The present invention is a (meth)acrylate (D) which is a reaction product of a thiol compound (A) having two or more mercapto groups; an iso(thio)cyanate compound (B) having two or more iso(thio)cyanato groups; and a hydroxy (meth)acrylate compound (C) having one or more polymerizable groups.

(Meth)acrylate and use thereof
12441821 · 2025-10-14 · ·

It is an object of the present invention to provide a monomer which can provide a cured product having both high toughness and rigidity. The present invention is a (meth)acrylate (D) which is a reaction product of a thiol compound (A) having two or more mercapto groups; an iso(thio)cyanate compound (B) having two or more iso(thio)cyanato groups; and a hydroxy (meth)acrylate compound (C) having one or more polymerizable groups.

CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS
20260063998 · 2026-03-05 · ·

A chemically amplified negative resist composition comprising (A) a quencher in the form of an onium salt containing an anion (Xq.sup.) which forms a conjugate acid (XqH) having a boiling point of lower than 165 C. and a molecular weight of up to 150, (B) a base polymer, and (C) a photoacid generator exhibits a high resolution and forms a pattern of satisfactory profile with low LER, fidelity and improved dose margin.

CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS
20260063998 · 2026-03-05 · ·

A chemically amplified negative resist composition comprising (A) a quencher in the form of an onium salt containing an anion (Xq.sup.) which forms a conjugate acid (XqH) having a boiling point of lower than 165 C. and a molecular weight of up to 150, (B) a base polymer, and (C) a photoacid generator exhibits a high resolution and forms a pattern of satisfactory profile with low LER, fidelity and improved dose margin.