A method including forming a formulation by contacting one or more photoinitiators with a composition including one or more 1, 1-disubstituted alkene compounds having a purity of about 85 mole percent or more based on total weight of the 1, 1-disubsituted alkene compounds; and exposing the formulation to ultraviolet radiation for initiating free radical polymerization, anionic polymerization, or both, to cure the formulation to form a non-tacky surface. The teachings also contemplate a polymer prepared according to the methods as disclosed.

The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.

The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.

Provided are a bisphenol represented by the general formula (1), a method for producing the bisphenol, and a polyarylate resin, a (meth)acrylate compound and an epoxy resin which are derived from the bisphenol. In the formula (1), R.sub.1 to R.sub.4 are the same or different, and each represent an alkyl group, an aryl group or a halogen atom, n.sub.1 and n.sub.2 are the same or different, and each represent an integer of 1 to 4, and k.sub.1 to k.sub.4 are the same or different, and each represent 0 or an integer of 1 to 4. When at least one of k.sub.1 to k.sub.4 is 2 or more, corresponding R.sub.1 to R.sub.4 may be the same or different.

Provided are a bisphenol represented by the general formula (1), a method for producing the bisphenol, and a polyarylate resin, a (meth)acrylate compound and an epoxy resin which are derived from the bisphenol. In the formula (1), R.sub.1 to R.sub.4 are the same or different, and each represent an alkyl group, an aryl group or a halogen atom, n.sub.1 and n.sub.2 are the same or different, and each represent an integer of 1 to 4, and k.sub.1 to k.sub.4 are the same or different, and each represent 0 or an integer of 1 to 4. When at least one of k.sub.1 to k.sub.4 is 2 or more, corresponding R.sub.1 to R.sub.4 may be the same or different.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure. The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Disclosed is a block copolymer having a first polymer block including a first primary monomer that is a 1,1-disubstituted alkene compound, wherein the first primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the first polymer block, the first polymer block covalently bonded to a second polymer block including a second primary monomer different from the first primary monomer, wherein the second primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the second polymer block. Also disclosed is a polymer comprising at least one monomer of a 1,1-disubstituted alkene compound having a weight average molecular weight of about 3000 daltons or more, wherein the polymer is substantially free of a melting temperature and is substantially free of a glass transition temperature of about 15 C. or more.