Disclosed is a block copolymer having a first polymer block including a first primary monomer that is a 1,1-disubstituted alkene compound, wherein the first primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the first polymer block, the first polymer block covalently bonded to a second polymer block including a second primary monomer different from the first primary monomer, wherein the second primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the second polymer block. Also disclosed is a polymer comprising at least one monomer of a 1,1-disubstituted alkene compound having a weight average molecular weight of about 3000 daltons or more, wherein the polymer is substantially free of a melting temperature and is substantially free of a glass transition temperature of about 15 C. or more.

Disclosed is a block copolymer having a first polymer block including a first primary monomer that is a 1,1-disubstituted alkene compound, wherein the first primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the first polymer block, the first polymer block covalently bonded to a second polymer block including a second primary monomer different from the first primary monomer, wherein the second primary monomer is present at a concentration of about 50 weight percent or more, based on the total weight of the second polymer block. Also disclosed is a polymer comprising at least one monomer of a 1,1-disubstituted alkene compound having a weight average molecular weight of about 3000 daltons or more, wherein the polymer is substantially free of a melting temperature and is substantially free of a glass transition temperature of about 15 C. or more.

Provided are a bisphenol represented by the general formula (1), a method for producing the bisphenol, and a polyarylate resin, a (meth)acrylate compound and an epoxy resin which are derived from the bisphenol. In the formula (1), R.sub.1 to R.sub.4 are the same or different, and each represent an alkyl group, an aryl group or a halogen atom, n.sub.1 and n.sub.2 are the same or different, and each represent an integer of 1 to 4, and k.sub.1 to k.sub.4 are the same or different, and each represent 0 or an integer of 1 to 4. When at least one of k.sub.1 to k.sub.4 is 2 or more, corresponding R.sub.1 to R.sub.4 may be the same or different.

Provided are a bisphenol represented by the general formula (1), a method for producing the bisphenol, and a polyarylate resin, a (meth)acrylate compound and an epoxy resin which are derived from the bisphenol. In the formula (1), R.sub.1 to R.sub.4 are the same or different, and each represent an alkyl group, an aryl group or a halogen atom, n.sub.1 and n.sub.2 are the same or different, and each represent an integer of 1 to 4, and k.sub.1 to k.sub.4 are the same or different, and each represent 0 or an integer of 1 to 4. When at least one of k.sub.1 to k.sub.4 is 2 or more, corresponding R.sub.1 to R.sub.4 may be the same or different.

The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.

The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

Prismatic polymer monolithic capacitor structure including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation into the structure (which can lead to higher dissipation factor and electrode corrosion). The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.

Prismatic polymer monolithic capacitor structure including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation into the structure (which can lead to higher dissipation factor and electrode corrosion). The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.