The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

Cure accelerators for anaerobic curable compositions, such as adhesives and sealants, are provided, and which are defined with reference to the aromatic amides shown in structure I

##STR00001##

where R and R are each independently C.sub.1-10 alkyl, and R is H or C.sub.1-10 alkyl or R and R together may form a four to seven membered ring fused to the benzene ring, and where R is optional, but when R is present, R is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, alkoxy, amino, alkylene- or alkenylene-ether, alkylene (meth)acrylate, carbonyl, carboxyl, nitroso, sulfonate, hydroxyl or haloalkyl.

Cure accelerators for anaerobic curable compositions, such as adhesives and sealants, are provided, and which are defined with reference to the aromatic amides shown in structure I

##STR00001##

where R and R are each independently C.sub.1-10 alkyl, and R is H or C.sub.1-10 alkyl or R and R together may form a four to seven membered ring fused to the benzene ring, and where R is optional, but when R is present, R is halogen, alkyl, alkenyl, cycloalkyl, hydroxyalkyl, hydroxyalkenyl, alkoxy, amino, alkylene- or alkenylene-ether, alkylene (meth)acrylate, carbonyl, carboxyl, nitroso, sulfonate, hydroxyl or haloalkyl.

The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in an emulsion (for example using a water based carrier liquid), despite the possible reactions between the monomer and water. Polymerization of 1,1-disubstituted alkene compounds in an emulsion provides opportunities to better control the polymerization compared with bulk polymerization. The emulsion polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.

A curable composition that includes a polymerizable monomer, an aluminum chelate compound, a silanol compound, and a quaternary boron-containing onium salt.

A curable composition that includes a polymerizable monomer, an aluminum chelate compound, a silanol compound, and a quaternary boron-containing onium salt.

A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:

##STR00001##

and a molecular weight of 2301,000, and (B) fumed silica having an average primary particle size of 1 nm50 nm and a specific surface area of 50 m.sup.2/g250 m.sup.2/g.

A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:

##STR00001##

and a molecular weight of 2301,000, and (B) fumed silica having an average primary particle size of 1 nm50 nm and a specific surface area of 50 m.sup.2/g250 m.sup.2/g.