[Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction.

[Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B).

##STR00001##

n=0 to 20

R.sub.1 is an alkyl group having 50 or less carbon atoms.

R.sub.3 is hydrogen or an alkyl group having 10 or less carbon atoms.

[Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction.

[Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B).

##STR00001##

n=0 to 20

R.sub.1 is an alkyl group having 50 or less carbon atoms.

R.sub.3 is hydrogen or an alkyl group having 10 or less carbon atoms.

[Problem] To obtain a thermosetting resin composition that has curing performance at a lower temperature and uses transesterification capable of also suitably coping with conversion into an aqueous form as a curing reaction.

[Solution] A thermosetting resin composition containing a resin component (A), which includes a structure (a) represented by the following general formula (1) and a hydroxy group (b), and a transesterification catalyst (B).

##STR00001##

n=0 to 20

R.sub.1 is an alkyl group having 50 or less carbon atoms.

R.sub.3 is hydrogen or an alkyl group having 10 or less carbon atoms.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

A curable composition containing: a compound represented by the following formula (1):

##STR00001##

wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.

An adhesive composition that is excellent in both adhesiveness and a holding force while having high flame retardancy. The adhesive composition contains an acrylic resin (A) containing a (meth)acrylic acid monomer (a1) unit and a hydroxyl group-containing monomer (a2) unit, an epoxy crosslinking agent (b1), an isocyanate crosslinking agent (b2), and a flame retardant (C).

An adhesive composition that is excellent in both adhesiveness and a holding force while having high flame retardancy. The adhesive composition contains an acrylic resin (A) containing a (meth)acrylic acid monomer (a1) unit and a hydroxyl group-containing monomer (a2) unit, an epoxy crosslinking agent (b1), an isocyanate crosslinking agent (b2), and a flame retardant (C).

An adhesive composition that is excellent in both adhesiveness and a holding force while having high flame retardancy. The adhesive composition contains an acrylic resin (A) containing a (meth)acrylic acid monomer (a1) unit and a hydroxyl group-containing monomer (a2) unit, an epoxy crosslinking agent (b1), an isocyanate crosslinking agent (b2), and a flame retardant (C).

The present invention is directed to coated articles demonstrating a transmission of electromagnetic radiation having a frequency of 22 to 81 GHz in the range of 70% to 100%. The articles comprise substrates coated with curable film-forming compositions comprising a first film-forming polymer prepared from at least one hydrophobic monomer, a second film-forming polymer prepared from at least one hydrophobic monomer, and a curing agent. Upon application of the curable film-forming composition to the substrate to form a coating layer, the first film-forming polymer is distributed throughout the coating layer, and the concentration of the second film-forming polymer is greater at the surface of the coating layer than the concentration of the second film-forming polymer within the bulk of the coating layer. The present invention is also drawn to methods of mitigating contaminant build-up on a substrate using the curable film-forming compositions described above.

The present invention is directed to coated articles demonstrating a transmission of electromagnetic radiation having a frequency of 22 to 81 GHz in the range of 70% to 100%. The articles comprise substrates coated with curable film-forming compositions comprising a first film-forming polymer prepared from at least one hydrophobic monomer, a second film-forming polymer prepared from at least one hydrophobic monomer, and a curing agent. Upon application of the curable film-forming composition to the substrate to form a coating layer, the first film-forming polymer is distributed throughout the coating layer, and the concentration of the second film-forming polymer is greater at the surface of the coating layer than the concentration of the second film-forming polymer within the bulk of the coating layer. The present invention is also drawn to methods of mitigating contaminant build-up on a substrate using the curable film-forming compositions described above.