C08F220/22

HIGHLY FLUORINATED NANOSTRUCTURED POLYMER FOAMS FOR PRODUCING SUPER-REPELLENT SURFACES

The present invention relates to a highly fluorinated nanostructured polymer foam as well as to its use as a super-repellent coating of substrates. Furthermore, the present invention relates to a composition and to a method for producing the highly fluorinated nanostructured polymer foam.

HIGHLY FLUORINATED NANOSTRUCTURED POLYMER FOAMS FOR PRODUCING SUPER-REPELLENT SURFACES

The present invention relates to a highly fluorinated nanostructured polymer foam as well as to its use as a super-repellent coating of substrates. Furthermore, the present invention relates to a composition and to a method for producing the highly fluorinated nanostructured polymer foam.

POSITIVE TONE RESIST COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

The present invention provides a positive tone resist composition containing (A) an ionic compound and (B) a resin that has a repeating unit (b1) having an interactive group which interacts with an ionic group in the ionic compound and of which a main chain is decomposed by an irradiation with X-rays, electron beam, or extreme ultraviolet rays; a resist film formed of the positive tone resist composition; a pattern forming method; and a method for manufacturing an electronic device.

POSITIVE TONE RESIST COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

The present invention provides a positive tone resist composition containing (A) an ionic compound and (B) a resin that has a repeating unit (b1) having an interactive group which interacts with an ionic group in the ionic compound and of which a main chain is decomposed by an irradiation with X-rays, electron beam, or extreme ultraviolet rays; a resist film formed of the positive tone resist composition; a pattern forming method; and a method for manufacturing an electronic device.

RESIST COMPOSITION AND PATTERNING PROCESS
20220382149 · 2022-12-01 · ·

A resist composition comprising a base polymer and a sulfonium or iodonium salt of a fluorinated sulfonic acid having a phenylene group which is substituted with an iodized phenyl-containing group and a nitro group is provided. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.

RESIST COMPOSITION AND PATTERNING PROCESS
20220382149 · 2022-12-01 · ·

A resist composition comprising a base polymer and a sulfonium or iodonium salt of a fluorinated sulfonic acid having a phenylene group which is substituted with an iodized phenyl-containing group and a nitro group is provided. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.

RESIST COMPOSITION AND PATTERNING PROCESS
20220382149 · 2022-12-01 · ·

A resist composition comprising a base polymer and a sulfonium or iodonium salt of a fluorinated sulfonic acid having a phenylene group which is substituted with an iodized phenyl-containing group and a nitro group is provided. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.

RESIST MATERIAL AND PATTERN FORMING METHOD
20220373886 · 2022-11-24 ·

It is an object of the present invention to form a resist film that is highly sensitive and enables high-resolution patterning. The present invention relates to a resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101). In the formula (101), R.sup.1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R.sup.1 may be the same or different. R.sup.11 represents a hydrogen atom or an alkyl group optionally having a substituent. R.sup.2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y.sup.1 represents a single bond or a linking group.

##STR00001##

RESIST MATERIAL AND PATTERN FORMING METHOD
20220373886 · 2022-11-24 ·

It is an object of the present invention to form a resist film that is highly sensitive and enables high-resolution patterning. The present invention relates to a resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101). In the formula (101), R.sup.1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R.sup.1 may be the same or different. R.sup.11 represents a hydrogen atom or an alkyl group optionally having a substituent. R.sup.2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y.sup.1 represents a single bond or a linking group.

##STR00001##

RESIST MATERIAL AND PATTERN FORMING METHOD
20220373886 · 2022-11-24 ·

It is an object of the present invention to form a resist film that is highly sensitive and enables high-resolution patterning. The present invention relates to a resist material that comprises a polymer comprising a unit derived from a structure represented by the following formula (101). In the formula (101), R.sup.1 each independently represents a hydrogen atom, an alkyl group optionally having a substituent, an acyl group optionally having a substituent, an allyl group optionally having a substituent, an alkoxy group optionally having a substituent, or an alkylsilyl group optionally having a substituent, and a plurality of R.sup.1 may be the same or different. R.sup.11 represents a hydrogen atom or an alkyl group optionally having a substituent. R.sup.2 represents a hydrogen atom, an alkyl group, a fluorine atom, a chlorine atom, a bromine atom, or a halogenated alkyl group; and Y.sup.1 represents a single bond or a linking group.

##STR00001##