Build materials for 3D printing applications are described herein which, in some embodiments, comprise a dye component operable to alter spectral characteristics of the printed part over the course of the build cycle. In some embodiments, for example, the dye component can provide desirable light penetration depth during article printing and sufficient optical clarity during final light curing processes.

Build materials for 3D printing applications are described herein which, in some embodiments, comprise a dye component operable to alter spectral characteristics of the printed part over the course of the build cycle. In some embodiments, for example, the dye component can provide desirable light penetration depth during article printing and sufficient optical clarity during final light curing processes.

An object of the present invention is to provide a pattern forming method which is excellent in developability and defect suppression performance. Another object of the present invention is to provide a method for producing an electronic device including the pattern forming method. Still another object of the present invention is to provide a kit capable of forming a pattern which is excellent in developability and defect suppression performance.

The pattern forming method of the present invention is a pattern forming method including a resist film forming step of forming a resist film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film using a developer, in which the actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin represented by a specific structure; and as the developer, a chemical liquid containing an organic solvent, alcohol impurities, and metal impurities containing at least metal atoms is used, the total content of the alcohol impurities being 0.01 mass ppb to 1000 mass ppm with respect to the total mass of the chemical liquid.

An object of the present invention is to provide a pattern forming method which is excellent in developability and defect suppression performance. Another object of the present invention is to provide a method for producing an electronic device including the pattern forming method. Still another object of the present invention is to provide a kit capable of forming a pattern which is excellent in developability and defect suppression performance.

The pattern forming method of the present invention is a pattern forming method including a resist film forming step of forming a resist film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film using a developer, in which the actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin represented by a specific structure; and as the developer, a chemical liquid containing an organic solvent, alcohol impurities, and metal impurities containing at least metal atoms is used, the total content of the alcohol impurities being 0.01 mass ppb to 1000 mass ppm with respect to the total mass of the chemical liquid.

Free-standing non-fouling polymers and polymeric compositions, monomers and macromonomers for making the polymers and polymeric compositions, objects made from the polymers and polymeric compositions, and methods for making and using the polymers and polymeric compositions.

A resin composition, a cured product using the resin composition, a laminate using the cured product, and a method for producing the laminate. The resin composition includes 1,1-dicyanoethylene (A) and a polymerizable monomer (B) represented by CHR.sup.1=CR.sup.2R.sup.3. The content of the 1,1-dicyanoethylene (A) in the resin composition is 2.0 to 99.9% by mass of the total mass of the 1,1-dicyanoethylene (A) and the polymerizable monomer (B).

A resin composition, a cured product using the resin composition, a laminate using the cured product, and a method for producing the laminate. The resin composition includes 1,1-dicyanoethylene (A) and a polymerizable monomer (B) represented by CHR.sup.1=CR.sup.2R.sup.3. The content of the 1,1-dicyanoethylene (A) in the resin composition is 2.0 to 99.9% by mass of the total mass of the 1,1-dicyanoethylene (A) and the polymerizable monomer (B).