C08F222/402

FLUORINE-CONTAINING POLYMER AND SURFACE TREATMENT AGENT

A fluorine-containing polymer including a repeat unit derived from a fluorine-containing monomer (A1) and a repeat unit derived from a hydrocarbon group-bearing fluorine-free monomer (A2). The fluorine-free monomer (A2) is preferably at least one monomer selected from (A2-1) R.sup.22—C(═O)—NH—R.sup.23—O—R.sup.21, (A2-2) CH.sub.2═C(—R.sup.32)—C(═O)—Y.sup.31—Z.sup.31(—Y.sup.32—R.sup.31).sub.n, and (A2-3) X.sup.41N(H).sub.r—R.sup.41. Also disclosed is a surface treatment agent containing (A) the fluorine-containing polymer and (B) a liquid medium, as well as a method for producing the surface treatment agent and a method for producing a treated substrate.

FLUORINE-CONTAINING POLYMER AND SURFACE TREATMENT AGENT

A fluorine-containing polymer including a repeat unit derived from a fluorine-containing monomer (A1) and a repeat unit derived from a hydrocarbon group-bearing fluorine-free monomer (A2). The fluorine-free monomer (A2) is preferably at least one monomer selected from (A2-1) R.sup.22—C(═O)—NH—R.sup.23—O—R.sup.21, (A2-2) CH.sub.2═C(—R.sup.32)—C(═O)—Y.sup.31—Z.sup.31(—Y.sup.32—R.sup.31).sub.n, and (A2-3) X.sup.41N(H).sub.r—R.sup.41. Also disclosed is a surface treatment agent containing (A) the fluorine-containing polymer and (B) a liquid medium, as well as a method for producing the surface treatment agent and a method for producing a treated substrate.

Allyl-phenoxy-cyclophosphazene compound, and production method therefor

An object of the present invention is to provide a mixture of cyclophosphazenes suitably substituted with phenoxy having a polymerizable functional group, such as allyl, on the phenyl ring and a production method for the mixture. The invention relates to a mixture of cyclophosphazene compounds that each contain a plurality of constituent units linked to each other, each constituent unit being represented by formula (I): ##STR00001##
wherein R.sup.1 and R.sup.2 are identical or different and represent C.sub.1-4 alkyl or the like, the mixture containing cyclophosphazene compounds in which 3, 4, and 5 constituent units represented by formula (I) are linked, wherein the cyclophosphazene compound containing 3 linked constituent units is cyclophosphazene compound (I-A) with a specific structure, compound (I-A) includes cyclophosphazene compounds (I-A2) and (I-A3) having a specific structure, and compounds (I-A2) and (I-A3) are present in an amount of 80 wt % or more in total in cyclophosphazene compound (I-A).

Allyl-phenoxy-cyclophosphazene compound, and production method therefor

An object of the present invention is to provide a mixture of cyclophosphazenes suitably substituted with phenoxy having a polymerizable functional group, such as allyl, on the phenyl ring and a production method for the mixture. The invention relates to a mixture of cyclophosphazene compounds that each contain a plurality of constituent units linked to each other, each constituent unit being represented by formula (I): ##STR00001##
wherein R.sup.1 and R.sup.2 are identical or different and represent C.sub.1-4 alkyl or the like, the mixture containing cyclophosphazene compounds in which 3, 4, and 5 constituent units represented by formula (I) are linked, wherein the cyclophosphazene compound containing 3 linked constituent units is cyclophosphazene compound (I-A) with a specific structure, compound (I-A) includes cyclophosphazene compounds (I-A2) and (I-A3) having a specific structure, and compounds (I-A2) and (I-A3) are present in an amount of 80 wt % or more in total in cyclophosphazene compound (I-A).

FLUORORESIN SUBSTRATE LAMINATE

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

FLUORORESIN SUBSTRATE LAMINATE

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

PHOTOSENSITIVE BISMALEIMIDE COMPOSITION

The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE

A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE

A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).

HEAT-CURABLE RESIN COMPOSITION, AND ADHESIVE AGENT, FILM, PREPREG, LAMINATE, CIRCUIT BOARD AND PRINTED-WIRING BOARD USING SAME

Provided are a heat-curable resin composition capable of being turned into a cured product having a high glass-transition temperature, a low dielectric tangent and a superior adhesion to a metal foil; and an adhesive agent, film, prepreg, laminate, circuit board as well as printed-wiring board using such heat-curable resin composition. The heat-curable resin composition contains: (A) a polyphenylene ether resin having reactive double bonds at molecular chain ends; (B) a (meth)acrylic acid ester compound; (C) a cyclic imide compound containing, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (D) a reaction initiator.