Method of manufacturing a photovoltaic module comprising at least a first layer and a second layer affixed to each other by means of an encapsulant, said method comprising a lamination step wherein the encapsulant material comprises a silane-modified polyolefin having a melting point below 90° C., pigment particles and an additive comprising a cross-linking catalyst; and wherein in said lamination step heat and pressure are applied to the module, said heat being applied at a temperature between 60° C. and 125° C.

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.

A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.

Disclosed are a heat-expandable polyvinylidene chloride microsphere and its preparation method. The preparation method comprises: by weight, dissolving 250 to 550 parts of an aqueous-phase polymerization inhibitor, 20 to 100 parts of a dispersant, and 3 to 15 parts of a co-dispersing monomer in deionized water, adjusting a pH value of the solution and cooling the solution to obtain an aqueous phase for later use; dissolving 5 to 15 parts of a cross-linking agent and 20 to 45 parts of an initiator in 1000 to 2000 parts of a mixed monomer, and cooling the solution to obtain an oil phase for later use; mixing and homogenizing the aqueous phase and the oil phase with stirring to obtain a homogenized mixed solution; adding 300 to 550 parts of a foaming agent to the homogenized mixed solution and homogenizing the resulting solution with stirring to obtain a homogenized mixed solution containing the foaming agent; reacting the homogenized mixed solution containing the foaming agent with stirring; at the end of the reaction, cooling to room temperature, filtering the resulting suspension to obtain filtrate, centrifuging and dehydrating the filtrate, and drying to obtain the heat-expandable polyvinylidene chloride microsphere product. This disclosure has the advantages of simple process and environmental friendliness, and the obtained product has good performance.

Disclosed are a heat-expandable polyvinylidene chloride microsphere and its preparation method. The preparation method comprises: by weight, dissolving 250 to 550 parts of an aqueous-phase polymerization inhibitor, 20 to 100 parts of a dispersant, and 3 to 15 parts of a co-dispersing monomer in deionized water, adjusting a pH value of the solution and cooling the solution to obtain an aqueous phase for later use; dissolving 5 to 15 parts of a cross-linking agent and 20 to 45 parts of an initiator in 1000 to 2000 parts of a mixed monomer, and cooling the solution to obtain an oil phase for later use; mixing and homogenizing the aqueous phase and the oil phase with stirring to obtain a homogenized mixed solution; adding 300 to 550 parts of a foaming agent to the homogenized mixed solution and homogenizing the resulting solution with stirring to obtain a homogenized mixed solution containing the foaming agent; reacting the homogenized mixed solution containing the foaming agent with stirring; at the end of the reaction, cooling to room temperature, filtering the resulting suspension to obtain filtrate, centrifuging and dehydrating the filtrate, and drying to obtain the heat-expandable polyvinylidene chloride microsphere product. This disclosure has the advantages of simple process and environmental friendliness, and the obtained product has good performance.

The present invention relates to an aqueous polymer dispersion containing a multistage emulsion polymer particle. The multistage emulsion polymer particle contains a polysiloxane formed in the first stage; a transition layer formed in the second stage; and a polyacrylate formed in the third stage. The transition layer is made of silane coupling agents. The present invention also relates to a method of preparing the aqueous polymer dispersion and use of the aqueous polymer dispersion for preparing coatings.

The present invention relates to an aqueous polymer dispersion containing a multistage emulsion polymer particle. The multistage emulsion polymer particle contains a polysiloxane formed in the first stage; a transition layer formed in the second stage; and a polyacrylate formed in the third stage. The transition layer is made of silane coupling agents. The present invention also relates to a method of preparing the aqueous polymer dispersion and use of the aqueous polymer dispersion for preparing coatings.

[Object] To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability; and further to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent.