A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.

A prepolymerized resin and a method of preparing the prepolymerized resin are provided, the method comprising a step of prepolymerizing t-butyl styrene and unsaturated bond-containing polyphenylene oxide. The unsaturated bond-containing polyphenylene oxide comprises: methacrylate-terminated polyphenylene oxide, vinylbenzyl-terminated polyphenylene oxide, vinylbenzyl-modified bisphenol A polyphenylene oxide resin, vinyl-containing chain-extended polyphenylene oxide resin or a combination thereof. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.

A prepolymerized resin and a method of preparing the prepolymerized resin are provided, the method comprising a step of prepolymerizing t-butyl styrene and unsaturated bond-containing polyphenylene oxide. The unsaturated bond-containing polyphenylene oxide comprises: methacrylate-terminated polyphenylene oxide, vinylbenzyl-terminated polyphenylene oxide, vinylbenzyl-modified bisphenol A polyphenylene oxide resin, vinyl-containing chain-extended polyphenylene oxide resin or a combination thereof. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.

A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.

A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.

A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.

A composition comprising a sizing agent comprising a bifunctional poly(arylene ether) comprising a silyl-containing group comprising a silyl-containing terminal group, a silyl-containing pendant group, or a combination thereof; and optionally comprising a terminal functional group, wherein the terminal functional group is not a silyl-containing terminal group or hydrogen.

The present invention provides a fluorine-containing active energy ray-curable composition containing specific amounts of (A) a fluoropolyether group-containing acrylic compound represented by the following formula:

V.sup.1Rf.sup.1-Z-Y(X).sub.b

(Rf.sup.1 is a divalent perfluoropolyether group. Z is a divalent organic group. Y is a (b+1)-valent organic group. X is an (-substituted) acrylic group-containing monovalent organic group. V.sup.1 is H, F, or -Z-Y(X).sub.b. b is 1-10.), (B) an acrylic compound having a viscosity of 5,000 mPa.Math.s or less at 23 C. and having an (-substituted) acrylic group in one molecule thereof, and (C) a photopolymerization initiator,
wherein the viscosity at 23 C. is 10-100,000 mPa.Math.s, and the refractive index at a temperature of 25 C. and a wavelength of 589 nm is 1.390 or less. The fluorine-containing active energy ray-curable composition is capable of being cured by means of active energy rays, such as ultraviolet rays or electron beams, is capable of forming a transparent cured product having a low refractive index and excellent water vapor resistance, and is also capable of having excellent handling properties.

The present invention provides a fluorine-containing active energy ray-curable composition containing specific amounts of (A) a fluoropolyether group-containing acrylic compound represented by the following formula:

V.sup.1Rf.sup.1-Z-Y(X).sub.b

(Rf.sup.1 is a divalent perfluoropolyether group. Z is a divalent organic group. Y is a (b+1)-valent organic group. X is an (-substituted) acrylic group-containing monovalent organic group. V.sup.1 is H, F, or -Z-Y(X).sub.b. b is 1-10.), (B) an acrylic compound having a viscosity of 5,000 mPa.Math.s or less at 23 C. and having an (-substituted) acrylic group in one molecule thereof, and (C) a photopolymerization initiator,
wherein the viscosity at 23 C. is 10-100,000 mPa.Math.s, and the refractive index at a temperature of 25 C. and a wavelength of 589 nm is 1.390 or less. The fluorine-containing active energy ray-curable composition is capable of being cured by means of active energy rays, such as ultraviolet rays or electron beams, is capable of forming a transparent cured product having a low refractive index and excellent water vapor resistance, and is also capable of having excellent handling properties.

A method of manufacturing a dual-cured polymer component includes additively manufacturing a green state component from a liquid photopolymerizable material; and dual post-curing the green state component by UV curing and thermal curing such that the dual-cured component is formed. The liquid photopolymerizable material has a composition includes an oligomer with a glass transition temperature greater than about 100 C., a monomer, and a photoinitiator. The thermal curing step is completed in a nitrogen environment to a temperature greater than the glass transition temperature of the oligomer. The dual-cured component has a heat deflection temperature between about 100 C. and 250 C. and an elongation at break between about 5% and 20%.