Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

Provided are a curable composition including, a block copolymer including a block A which has a constitutional unit having an ethylenically unsaturated group in a side chain of a polymer compound, a pigment, and, a photopolymerization initiator, in which a content of a polymerizable compound is 15 mass % or less with respect to a total solid content of the curable composition; a cured product of the curable composition; a color filter including the cured product; and a solid-state imaging element or an image display device including the color filter.

Provided are: a composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.

Provided are: a composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

The present invention relates to a composition and to a method of manufacturing a composition.

The present invention relates to a composition and to a method of manufacturing a composition.

An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2):

##STR00001##

[in the formula (1), R.sup.1 represents a hydrogen atom or a methyl group, and R.sup.2 represents an alkyl group having 12-30 carbon atoms]

##STR00002##

[in the formula (2), R.sup.3 and R.sup.5 each independently represent a hydrogen atom or a methyl group, and R.sup.4 represents a divalent organic group].

An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2):

##STR00001##

[in the formula (1), R.sup.1 represents a hydrogen atom or a methyl group, and R.sup.2 represents an alkyl group having 12-30 carbon atoms]

##STR00002##

[in the formula (2), R.sup.3 and R.sup.5 each independently represent a hydrogen atom or a methyl group, and R.sup.4 represents a divalent organic group].

Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.