A coating composition that includes: (a) core-shell particles having a polymeric core at least partially encapsulated by a polymeric shell; (b) an ethylenically unsaturated rubber polymer; and (c) an adhesion promoter including at least one polymer that is different from (a) and (b). The polymeric shell of (a) includes: (i) a barrier segment having aromatic groups; and urethane linkages, urea linkages, or a combination thereof; and (ii) an elastomeric segment that is different from (i), in which the polymeric shell is covalently bonded to at least a portion of the polymeric core. Further, the ethylenically unsaturated rubber polymer is: (i) a polymeric particle dispersed in an aqueous medium that is different from (a); or (ii) covalently bonded to the shell of the core-shell particles of (a) and forms at least a portion of the polymeric core.

A solid polymer electrolyte and a method of manufacturing the same are provided. More particularly, a solid polymer electrolyte having a high content of solids and exhibiting a flame retardant property and a method of manufacturing the same, wherein the solid polymer electrolyte includes a multifunctional acrylate-based polymer, a C2 to C10 polyalkylene oxide, a lithium salt and a non-aqueous solvent and wherein the multifunctional acrylate-based polymer is cross-linked with the polyalkylene oxide to form a semi-interpenetrating polymer network (semi-IPN).

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

The present invention relates to an anaerobically curable impregnation sealant composition and methods thereof containing a (meth)acrylic monofunctional monomer with a hydrophobic moiety, a (meth)acrylic monofunctional monomer with a hydroxyl group, a modified polyester urethane methacrylate resin having a weight average molecular weight of from about 8000 to about 18000 g/mol, and triallylisocyanurate, triallylcyanurate, or derivatives thereof, or a combination thereof. The present invention particularly relates to a sealant composition for impregnation to plastic and metal substrates that also provides resistance to thermal cycling.

The present invention relates to an anaerobically curable impregnation sealant composition and methods thereof containing a (meth)acrylic monofunctional monomer with a hydrophobic moiety, a (meth)acrylic monofunctional monomer with a hydroxyl group, a modified polyester urethane methacrylate resin having a weight average molecular weight of from about 8000 to about 18000 g/mol, and triallylisocyanurate, triallylcyanurate, or derivatives thereof, or a combination thereof. The present invention particularly relates to a sealant composition for impregnation to plastic and metal substrates that also provides resistance to thermal cycling.

A coating composition that includes: (a) core-shell particles having a polymeric core at least partially encapsulated by a polymeric shell; (b) an ethylenically unsaturated rubber polymer; and (c) an adhesion promoter including at least one polymer that is different from (a) and (b). The polymeric shell of (a) includes: (i) a barrier segment having aromatic groups; and urethane linkages, urea linkages, or a combination thereof; and (ii) an elastomeric segment that is different from (i), in which the polymeric shell is covalently bonded to at least a portion of the polymeric core. Further, the ethylenically unsaturated rubber polymer is: (i) a polymeric particle dispersed in an aqueous medium that is different from (a); or (ii) covalently bonded to the shell of the core-shell particles of (a) and forms at least a portion of the polymeric core.

A coating composition that includes: (a) core-shell particles having a polymeric core at least partially encapsulated by a polymeric shell; (b) an ethylenically unsaturated rubber polymer; and (c) an adhesion promoter including at least one polymer that is different from (a) and (b). The polymeric shell of (a) includes: (i) a barrier segment having aromatic groups; and urethane linkages, urea linkages, or a combination thereof; and (ii) an elastomeric segment that is different from (i), in which the polymeric shell is covalently bonded to at least a portion of the polymeric core. Further, the ethylenically unsaturated rubber polymer is: (i) a polymeric particle dispersed in an aqueous medium that is different from (a); or (ii) covalently bonded to the shell of the core-shell particles of (a) and forms at least a portion of the polymeric core.

A composition is provided comprising an epoxide functional polymer comprising epoxide functional groups, wherein the epoxide functional polymer has a number average molecular weight of 1000 to 10.000 g/mol and a grafted polylactic acid, wherein the polylactic acid is grafted with an acid-functional ethylenically unsaturated polymerizable monomer and/or an acid anhydride-functional ethylenically unsaturated polymerizable monomer and has a total amount of carboxylic acid groups and carboxylic acid anhydride groups between 10.0 and 60.0 mg KOH/g.

Some polymeric devices, as described herein, can be made of a first layer and a second layer bonded together with one or more microfluidic channels defined internal to the device. The first layer and the second layer may each include a substrate and a polymer bonded to the substrate. The two layers may be bonded through a polymer network that interpenetrates the polymers in the first and second layers. This disclosure also describes methods of bonding together polymeric articles. The methods include diffusing polymerizable monomers and radical forming initiators into the surfaces of one or both of the polymers, putting the surfaces into contact, and initiating polymerization to create a polymer network that interpenetrates the polymers.