A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of:

##STR00001##

photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of:

##STR00002##

and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R.sub.1 group, and diamine monomers each having the R.sub.2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R.sub.1 group is a soft long-chain diamine monomer. R.sub.2 group comprises at least one secondary amine group or tertiary amine group.

A sowing unit is provided including water-absorbing material, an enclosure and a seed. The water-absorbing material is vermiculite, which is a hygroscopic negatively-charged material capable of binding a positively charged nutrient ion selected from NH4+, L-arginine, L-lysine and L-histidine. Further, there is least one hole in the water-absorbing material arranged to hold one or more seeds.

A sowing unit including water-absorbing material, an enclosure and a seed, wherein the water-absorbing material includes a hygroscopic negatively-charged material capable of binding a positively charged nutrient ion selected from NH4+, L-arginine, L-lysine and L-histidine; and optionally a nutrient including a positively charged nutrient ion selected from K+, NH4+, L-arginine, L-lysine and L-histidine. Methods and uses of the sowing unit are described.

A negative-type photosensitive polymer of the present invention is a solvent-soluble negative-type photosensitive polymer which has a structural unit containing an imide ring, the negative-type photosensitive polymer containing a group having a terminal double bond, in which an average value of positive electric charges (?+) of two carbonyl carbons of the imide ring is equal to or less than 0.099 as calculated by a charge equilibration method.

Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition.

A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A.sup.1 and A.sup.2 each independently represent an oxygen atom or NH, R.sup.111 and R.sup.112 each independently represent a single bond or a divalent organic group, and R.sup.113 and R.sup.114 each independently represent a hydrogen atom or a monovalent organic group.

##STR00001##

There are provided a resin composition containing at least one resin selected from the group consisting of a polyimide and a precursor thereof, in which a dielectric loss tangent of a cured substance obtained by heating the resin composition at 230 C. for 1 hour is less than 0.03, a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device.

The present disclosure relates to a poly(amide-imide) copolymer in which each of at least one of imide repeating units and at least one of amide repeating units is substituted with a functional group including Chemical Formula 1, ##STR00001##
wherein, R.sub.1 is hydrogen or an alkyl group having 1 to 10 carbon atoms, and L is a single bond or an alkylene having 1 to 10 carbon atoms, and a composition and a polymer film comprising the same.

Provided are a resin composition including at least one resin selected from the group consisting of polyimide and a precursor of the polyimide, a polymerizable compound, and a polymerization initiator, in which a dissolution rate of a film having a film thickness of 10 m, which is obtained from the resin composition, in cyclopentanone is 0.01 to 0.55 m/sec, a cured substance obtained by curing the composition, a laminate including the cured substance, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the method for a cured substance, and a semiconductor device including a cured substance.