This resin film is characterized by comprising a segment represented by chemical formula 1 and a segment represented by chemical formula 2, and by satisfying condition 1. Condition 1: In an FT-IR spectrum of the resin film, a minimum value (T.sub.1) of transmittance at not lower than 3250 cm-1 but lower than 3350 cm-1 and a minimum value (T.sub.2) of transmittance at not lower than 3350 cm-1 but lower than 3450 cm-1 satisfy formula 1:

T.sub.2<T.sub.1  Formula 1:

The present invention provides: a resin film that has flexibility and high restoration properties and simultaneously exhibits heat resistance; and a laminated body having said resin film.

##STR00001##

Provided is a compound capable of forming a coating layer that has excellent scratch resistance and still has stain resistance (in particular, stain resistance against hair dyes) and workability (impact resistance) both at satisfactory levels. The urethane (meth)acrylate has a cyclic structure in a molecule. The urethane (meth)acrylate has a total weight of carbon, oxygen, nitrogen, and sulfur atoms constituting the ring or rings of the cyclic structure of 10 percent by weight or more based on the total amount (100 percent by weight) of the urethane (meth)acrylate. The urethane (meth)acrylate also has an average number of functional groups of 3.5 to 4.5.

The present technology provides a curable resin composition that contains a urethane prepolymer having an isocyanate group, a coated amine formed by using a filler to coat solid amine having a melting point of 50 C. or higher, an isocyanate group-containing compound having an isocyanate group bonded to an aliphatic hydrocarbon group and having a hydrolyzable silyl group or (meth)acryloyl group, and a tertiary amine compound.

The present disclosure is drawn to reactive polyurethane dispersions. In one example, a reactive polyurethane dispersion can include a polymer strand having a polymer backbone that has two ends terminating at a first capping unit and a second capping unit. The polymer backbone can include polymerized monomers including a reactive diol and a diisocyanate. The reactive diol can be an acrylate-containing diol, a methacrylate-containing diol, an acrylamide-containing diol, a methacrylamide-containing diol, or combination thereof. The first capping unit can be an acrylamide-containing monoalcohol or methacrylamide-containing monoalcohol reacted with an isocyanate group of the diisocyanate. The second capping unit can be an ionic stabilizing group.

The present invention provides an adhesive film including a resin having a silsesquioxane in a side chain and a urethane bond in a main chain, together with a method for forming the same. The inventive adhesive film has excellent stretchability and strength, with the film surface having higher adhesion and thinner film thickness.

A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: ##STR00001##
photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: ##STR00002##
and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R.sub.1 group, and diamine monomers each having the R.sub.2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R.sub.1 group is a soft long-chain diamine monomer. R.sub.2 group comprises at least one secondary amine group or tertiary amine group.

The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

A photo-curable resin composition for three-dimensional molding which does not require a support material is provided and can be cured by light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short period of time. The photo-curable resin composition has a viscosity at 20 C. of 0.2 Pa.Math.s or more and a viscosity at 150 C. of 1000 Pa.Math.s or less.

The invention relates to a urethane oligomer which according to a) or b) as follows, has: a) at least two backbone residues R issued from a polyisocyanate without the NCO groups, linked between them with a diol residue R.sub.B (diol without the two OH groups) by two urethane bonds (NHCOO) and each of said backbone residues R carrying (or linked to) at least two urethane segments each one of which, contains at least one terminal allyl group, preferably from 1 to 5 terminal allyl groups, b) at least one backbone residue R issued from a polyisocyanate without the NCO groups, said backbone residue R carrying (or linked to) at least two urethane segments each linked to R by one urethane bond with at least one urethane segment (arm) containing at least one terminal allyl group (preferably from 1 to 5 terminal allyl groups), and at least one urethane segment (arm) containing at least one terminal (meth)acrylate group (preferably from 1 to 5 terminal (meth)acrylate groups). The present invention also relates to a curable composition containing the urethane oligomer, the method of preparing the urethane oligomer, and the use of the urethane oligomer or the curable composition in the presence of air, for good surface properties by reducing oxygen inhibition in coatings, adhesives, sealants or in resin matrix.

A sheet-shaped matched-type electromagnetic wave absorber can obtain electromagnetic wave absorption performance with a relatively small thickness but has a problem that particularly a dimensional change in an electromagnetic wave absorption layer (resin composition layer) has a large influence on the electromagnetic wave absorption performance when being exposed to a high temperature. By laminating a resin composition layer in which a filler with an aspect ratio of 5 or more and a filler with an aspect ratio of less than 5 are dispersed and fixed with an electromagnetic wave reflection layer in a cured product of a resin composition containing an acrylic polymerizable resin and a polymerization initiator, it is possible to provide a matched-type electromagnetic wave absorber having high heat resistant dimensional stability and high electromagnetic wave absorption performance.