C08G59/06

Methods of preparing compositions for containers and other articles and methods of using same

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

PHOTOCURABLE REAGENT(S) FOR FORMING CHLORIDE ION-SELECTIVE SENSOR(S) AND METHODS OF PRODUCTION AND USE THEREOF

Improved formulation(s), device(s), and method(s) for producing ion-selective electrodes (ISEs) that comprise at least one photo-curable, epoxy-based, ion-selective chloride membrane(s) compounds that can be pre-mixed together to form a singularly-dispensed mixture for the formation of an ion-exchange resin membrane(s) for incorporation and use in a chloride ISE.

PHOTOCURABLE REAGENT(S) FOR FORMING CHLORIDE ION-SELECTIVE SENSOR(S) AND METHODS OF PRODUCTION AND USE THEREOF

Improved formulation(s), device(s), and method(s) for producing ion-selective electrodes (ISEs) that comprise at least one photo-curable, epoxy-based, ion-selective chloride membrane(s) compounds that can be pre-mixed together to form a singularly-dispensed mixture for the formation of an ion-exchange resin membrane(s) for incorporation and use in a chloride ISE.

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set
11572467 · 2023-02-07 · ·

Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.

Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set
11572467 · 2023-02-07 · ·

Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.

Curable Resin, Curable Resin Composition, Cured Product, Electronic Device, Laminated Board Material, Electronic Component Encapsulant, and Method for Producing Curable Resin
20230097638 · 2023-03-30 ·

A curable resin represented by General Formula (1). In General Formula (1), R.sub.1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R.sup.2's are each independently a monovalent group including a polymerizable functional group.

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Curable Resin, Curable Resin Composition, Cured Product, Electronic Device, Laminated Board Material, Electronic Component Encapsulant, and Method for Producing Curable Resin
20230097638 · 2023-03-30 ·

A curable resin represented by General Formula (1). In General Formula (1), R.sub.1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R.sup.2's are each independently a monovalent group including a polymerizable functional group.

##STR00001##

Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator

This compound which has excellent solvent solubility and compatibility with a resin, and which can generate bases and radicals with high efficiency by being irradiated with active energy rays, is represented by formula (1), where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.5 and R.sub.6 represent a hydroxy group or an alkoxy group; the R.sub.4's independently represent an organic group containing a thioether bond; R.sub.7 and R.sub.9 independently represent a hydrogen atom or an alkyl group with 1 to 4 carbons; R.sub.8 represents an alkylene group or an arylene group; and X represents an oxygen atom or a sulfur atom. A photopolymerization initiator can include said novel compound; and a photosensitive resin composition can include said photopolymerization initiator, from which a cured product can be obtained that has high sensitivity and no metal corrosion. ##STR00001##

Structural adhesive compositions

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.