The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.

Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

Embodiments of this invention are directed to bio-based epoxy compositions, and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives, or composites.

An adhesive for an endoscope, the adhesive including an epoxy resin including at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, or phenol novolac epoxy resin, a curing component, and a rubber component; a cured product of the adhesive; an endoscope including the cured product fixed; and a method for producing the endoscope. Note that adhesives in which the rubber component is acrylic rubber are excluded.

An adhesive for an endoscope, the adhesive including an epoxy resin including at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, or phenol novolac epoxy resin, a curing component, and a rubber component; a cured product of the adhesive; an endoscope including the cured product fixed; and a method for producing the endoscope. Note that adhesives in which the rubber component is acrylic rubber are excluded.

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

To provide an epoxy resin composition that exhibits excellent low dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, a phenol resin and an epoxy resin for providing the composition, and a method for producing such a resin. A phenol resin containing a dicyclopentenyl group and represented by the following general formula (1): wherein each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms; each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; i is an integer of 0 to 2; and n represents the number of repetitions and an average value thereof is a number of 10 to 10.

##STR00001##

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

A thermoplastic polyester resin composition has an excellent retention stability and is capable of producing a molded article excellent in mechanical properties and heat resistance as well as in long-term hydrolysis resistance; and the molded article. The thermoplastic polyester resin includes 100 parts by weight of a thermoplastic polyester resin (A) and 0.1 to 10 parts by weight of a biphenyl aralkyl-type epoxy resin or cyclopentadiene-type epoxy resin (B) of a specific type.

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I):

##STR00001##

X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.