C08G59/1438

Resin containing oxetane and epoxy groups and resin composition including the same

A resin containing oxetane and epoxy groups is provided, being formed by reacting (a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and (b) 2.1 to 4.2 parts by mole of a diepoxy compound. The mono-oxetane with a hydroxyl group has a structure: ##STR00001##
wherein R.sup.1 is H, C.sub.1-6 alkyl group, C.sub.1-6 fluoroalkyl group, alkenyl group, or phenyl group, and R.sup.2 is C.sub.1-6 alkylene group or vinyl ether group.

DUAL FUNCTION REAGENT, TRANSFER FIBERS, TRANSFER LAYER, AND ABSORBENT ARTICLES

The present invention relates to a dual function reagent composed of a polymeric chain and end caps, transfer fibers made from cellulose fibers and the dual function reagent, a liquid transfer layer made from the transfer fibers, and absorbent articles incorporating the liquid transfer layer. Embodiments of the present invention also relate to methods of making and using the dual function reagent, transfer fibers, transfer layer and absorbent articles.

Silane functionalized compounds and compositions thereof

Compositions comprising Silane functionalized compounds are provided. In one embodiment, the silane functionalized compounds include an epoxy resin derived backbone having silane functional groups pendant to the backbone or serving as end caps. The compositions comprising silane functionalized compounds may be utilized in a variety of applications including in coating formulations, adhesive formulations, composite materials, and combinations thereof.

Aqueous epoxy resin dispersions
09938428 · 2018-04-10 · ·

The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.

THERMOSETTING RESIN COMPOSITION, ELECTRONIC PART, ELECTRIC MACHINE COIL, ELECTRIC MACHINE, AND CABLE
20180086876 · 2018-03-29 · ·

It is an object of the present invention to provide a thermosetting resin composition which allows stress relaxation in an ester exchange reaction and the long-term use of the thermosetting resin composition having such a structure. A thermosetting resin composition of the present invention contains: an ester bond; and a functional group protected by a protecting group. The functional group is deprotected by external stimulus. The functional group and the ester bond can be subjected to an ester exchange reaction.

CYCLIC SILOXANE COMPOUNDS AND COMPOSITIONS COMPRISING THE SAME

A composition comprises a plurality of cyclic siloxane compounds. At least a portion of the cyclic siloxane compounds comprise first and second siloxane moieties having specified structures. A cyclic siloxane compound comprises a first siloxane moiety having a specified structure and a second siloxane moiety having a specified structure. An epoxy composition is made by reacting a composition comprising a plurality of cyclic siloxane compounds, an epoxy resin, and a curative. An epoxy composition is made by reacting a cyclic siloxane compound, an epoxy resin, and a curative.

Fluorinated alkyl ether epoxy resin compositions and applications thereof

Epoxy resin compositions prepared using amino terminated fluoro alkyl ethers. The epoxy resin compositions exhibit low surface adhesion properties making them useful as coatings, paints, moldings, adhesives, and fiber reinforced composites.

Bisphenol-A free polyether resins based on phenol stearic acid and coating compositions formed therefrom

Coating compositions can be prepared from a polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, and reacting the diphenol with a diglycidyl ether compound to form the polyether resin.

Compositions and methods for decontamination of surfaces
12605477 · 2026-04-21 · ·

Disclosed are methods and compounds useful for forming coatings applied to porous and non-porous surfaces to make the surface antimicrobial and to protect against contaminants. The coatings are formed from phenolic compounds present in a solvent either alone or in combination with other compounds, such as metallic salts.