A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure, a hydrocarbon structure, and a solvent. The compound may have the photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure and the hydrocarbon structure in one molecule, or may be a combination of compounds which contain the structures in separate molecules.

A polymer includes the reaction product of A, B, and C, and optionally D, wherein: A is a polyepoxide that is: the condensation product of phenol, formaldehyde, and epichlorohydrin; the condensation product of bisphenol A, formaldehyde, and epichlorohydrin; or a combination of said condensation products; B is at least one polyoxyalkylene with a terminal primary amine group wherein each polyoxyalkylene comprises an ethyleneoxy moiety and a propyleneoxy moiety and independently has the following structure: ##STR00001## wherein R is a hydrogen atom or a C.sub.1-C.sub.4 group, and wherein each of x and y is independently from 0 to about 500 and x+y>0; and C is an anchoring compound that is: a secondary amine; a monocarboxylic acid; a cyclic imide; or a combination thereof, and D is an alkylating agent. This polymer is included in a composition that further includes a compound such as a particulate solid.

An epoxy resin emulsion includes a continuous phase including an aqueous carrier and an acid. The emulsion also includes a dispersed phase including an epoxy resin. The epoxy resin is the reaction product of an amine compound and a first epoxy reactant. The first epoxy reactant itself includes the reaction product of (1) an aromatic diol monomer, (2) a di-glycidyl ether of Bisphenol A and/or a di-glycidyl ether of catechol, and (3) a C8-C18 alkyl phenolic end-capping agent. The (1) aromatic diol monomer has the structure: ##STR00001##
In this structure, each of R.sup.1-R.sup.4 is independently a hydrogen atom, a C.sub.1-C.sub.8 alkyl group, a C.sub.3-C.sub.8 cycloalkyl group, an aryl group, an aralkyl group, a halide group, a cyano group, a nitro group, a blocked isocyanate group, or a C.sub.1-C.sub.8 alkyloxy group or wherein any two or more of R.sup.1-R.sup.4 may be a fused ring.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

An epoxy composition is provided that includes a polyepoxy aniline, a rheology modifier, a filler, and a polyamine hardener comprising a cyclic hydrocarbon-containing polyamine. When cured, the epoxy composition provides an advantageous chemical resistance at high temperatures and pressures. Additionally, the cured epoxy compositions have good adhesion to substrates and resist blistering.

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and has a solids content of 90% or greater. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; an optional second hydroxyl-containing compound having a single OH group, wherein; and an epoxy component. The epoxy component is present in an amount of 35% by weight or greater, based on the total weight of the polymerizable composition. The first hydroxyl-containing compound has more than one OH group and the optional second hydroxyl-containing compound is a primary alcohol or a secondary alcohol. The present disclosure also provides a two-part composition, in which the polymeric material is included in the first part and the second includes at least one amine. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymeric material and a method of making a two-part composition. Advantageously, two-part compositions can be used as coatings and adhesive systems with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water, or with performance similar to toughened epoxy systems.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

A surfactant comprising the reaction product of: (a) an epoxidised carboxylic acid ester; and (b) a compound including at least one reactive alcohol and/or amino functional group.

A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): ##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.