A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or sulfur-containing structure, a hydrocarbon structure, and a solvent. A compound which contains at least one photodegradable structure in one molecule. A compound which contains the photodegradable structures, and the hydrocarbon structure in one molecule, or a combination of compounds which contain the structures in separate molecules. The hydrocarbon structure is a saturated or unsaturated, linear, branched or cyclic hydrocarbon group having a carbon atom number of 1 to 40. The nitrogen-containing structure contains a reactive nitrogen-containing functional group or reactive carbon-containing functional group produced by irradiation with ultraviolet light; and the sulfur-containing structure contains an organic sulfur radical or carbon radical produced by irradiation with ultraviolet light.

Disclosed is a composition and use thereof for the recovery of hydrocarbon fluids from a subterranean reservoir. More particularly, this invention concerns -glycol containing sulfonated epoxy resin composition and method for preparing said composition. The -glycol containing sulfonated epoxy resin composition is made by forming a reaction product comprising an epoxide-containing compound, a primary amino sulfonate, and optionally one or more of a primary monoamine alkylene oxide oligomer, followed by converting any unreacted epoxide groups in the reaction product to -glycol groups by hydrolysis. Said -glycol containing sulfonated epoxy resin compositions demonstrate good solubility in aqueous solutions and are useful for modifying the permeability of subterranean formations and increasing the mobilization and/or recovery rate of hydrocarbon fluids present in the formations.

Aspects of the present disclosure relate to Schiff base oligomers and uses thereof. In at least one aspect, an oligomer is represented by Formula (I) wherein each instance of R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.10, R.sup.11, R.sup.12, R.sup.13, and R.sup.14 is independently selected from the group consisting of hydrogen, alkyl, cycloalkyl, alkoxyl, aryloxyl, ether, and heterocyclyl. Each instance of R.sup.9 of Formula (I) is independently selected from the group consisting of alkyl, cycloalkyl, aryl, heterocyclyl, and ether. Each instance of R.sup.28 and R.sup.29 of Formula (I) is independently selected from the group consisting of hydrogen, alkyl, and aryl. Each instance of R.sup.33 of Formula (I) is independently selected from the group consisting of alkyl, cycloalkyl, aryl, heterocyclyl, and a bond. Each instance of R.sup.41 of Formula (I) is independently NH or a bond and each instance of R.sup.40 is independently NH or NHNH.

The present invention provides a composition for forming a resist underlayer film with which a desired resist pattern can be formed, a method for manufacturing a resist pattern wherein said resist underlayer film-forming composition is used, and a method for manufacturing a semiconductor device. The resist underlayer film-forming composition includes a polymer that supports an acid compound at a terminal end thereof, and a solvent. The acid compound may be ionically bonded to a base that is present at the terminal end of the polymer. Said terminal end may be represented by formula (1) (in the formula, A1 represents an acid compound, B represents a basic structure, and * represents a section of bonding with a polymer moiety).

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, Y representsOCO, O or S, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

A photocurable composition for forming coating film having flattening properties on a substrate, with high fillability into patterns and capability of forming a coating film that is free from thermal shrinkage, which contains at least one compound that contains a photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure, a hydrocarbon structure, and a solvent. The compound may have the photodegradable nitrogen-containing and/or photodegradable sulfur-containing structure and the hydrocarbon structure in one molecule, or may be a combination of compounds which contain the structures in separate molecules.

The present invention relates to an epoxy-resin composition comprising the following components (A), (B), (C) and (D), a film made of the epoxy resin composition, a prepreg and a fiber-reinforced plastic. The present invention can provide an epoxy-resin composition that cures at a low temperature in a short period of time. Also, the present invention can provide a fiber-reinforced plastic having excellent mechanical characteristics, especially excellent fracture toughness and heat tolerance, is made from the epoxy-resin composition. component (A): an epoxy resin having a monomer unit represented by formula (1) in the molecule; component (B): a bifunctional epoxy resin with a number-average molecular weight of at least 600 but no greater than 1300, which does not have a monomer unit represented by formula (1) below in the molecule; component (C): a triblock copolymer; and component (D): a curing agent. ##STR00001##

A corrosion inhibitor coating composition includes a polymerized thiosemicarbazone, and a thiirane crosslinker, where the thiirane crosslinker is a difunctional molecule. The corrosion inhibitor coating composition can include where the thiirane crosslinker may include an aliphatic thiirane, a tri-functional thiirane, a bisphenol thiirane, or a combination thereof. The corrosion inhibitor coating composition can be metal-free and catalyst-free. An article utilizing and a method of preparing a corrosion inhibitor coating composition is also disclosed, which can include adding a thiourea to a difunctional epoxy terminated molecule in solution in the presence of a catalyst, converting the difunctional epoxy terminated molecule to a thiirane terminated difunctional molecule, and purifying the thiirane terminated difunctional molecule to produce a thiirane.

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, Y represents OCO, O or S, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).

A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw material with an epoxy resin in the presence of water, so as to obtain an ionic active emulsifier. The ionic active emulsifier molecule comprises at least one epoxy group from an epoxy resin and at least one sulfonic acid or sulfonate group from the first reaction raw material. The aqueous epoxy resin dispersion prepared by using the emulsifier has the characteristics of good stability and good corrosion resistance after curing, and can be used in the fields of coatings, adhesives, etc.