Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.

The invention relates to comb copolymers, which can be produced from at least one diglycidyl ether (A) of general formula (I), at least one polyether monoamine (B) of the general formula R.sup.t—[OEt].sub.n[OPr].sub.m[OBu].sub.s—NH.sub.2, at least one amine (C) of the general formula Z—R.sup.1—NH.sub.2, and optionally at least one secondary amine (D) that is free of primary amino groups and is of the general formula NHTV, wherein R stands for a residue free of epoxy groups, selected from aliphatic residues, aromatic residues, and araliphatic residues; R.sup.t stands for a residue selected from alkyl residues having 1 to 6 carbon atoms; OEt stands for an ethylene oxide residue, OPr stands for a propylene oxide residue, and OBu stands for a butylene oxide residue; n stands for a number from 0 to 100, m stands for a number from 3 to 50, and s stands for a number from 0 to 20, and n+m+s=3 to 103; R.sup.1 stands for an aliphatic, aromatic, or araliphatic hydrocarbon residue having 1 to 12 carbon atoms; Z stands for a residue free of primary and secondary amino groups and having at least one basic nitrogen atom, T and V do not contain any secondary amino groups and stand, independently of each other, for aliphatic residues having 1 to 12 carbon atoms, aromatic residues having 6 to 12 carbon atoms, or araliphatic residues having 7 to 12 carbon atoms, wherein the molar number of the sum of the primary amino groups of the polyether monoamines (B) and primary amino groups of the amines (C) divided by the molar number of the epoxy groups of the diglycidyl ethers (A) equals a value of ⅓ to ¾. The invention further relates to the production of the comb copolymers, dispersions, particulate preparations, wetting agents, and dispersants that contain the comb copolymers, to particles coated with the comb copolymers, and to the use of the comb copolymers as wetting agents and dispersants, in particular for increasing the jetness.

Provided is an epoxy-amine adduct that offers high reactivity, contributes to better adhesion between a resin and a reinforcing fiber in a fiber-reinforced composite material, and can be easily blended with another component such as a resin. The epoxy-amine adduct has two or more amino groups per molecule and is obtained by a reaction of an epoxy compound (A) having two or more alicyclic epoxy groups per molecule with an amine compound (B) having two or more amino groups per molecule. The epoxy compound (A) is preferably a compound represented by Formula (a): ##STR00001##

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

An ionic aqueous epoxy curing agent, a preparation method therefor and the use thereof. The aqueous epoxy curing agent is prepared by reacting the following raw materials in parts by weight: a) 1 part of a polyepoxy compound, b) 1.3-6 parts of a multifunctional compound, c) 0.2 to 1.25 parts of a monoepoxy compound, and d) 0.01 to 0.23 parts of a sultone, wherein the multifunctional compound has four or more active hydrogens. The curing agent obtained has a good hydrophilic effect and very good thinning performance, the paint film prepared by mixing same with an epoxy dispersion has the following advantages: excellent salt spray resistance and water resistance, strong adhesion, high hardness, etc.; in addition, the preparation process of the curing agent is simple, the conditions are mild, and room temperature curing is carried out.

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.- %, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

The present invention relates to adhesive compositions containing a prepolymer which can be obtained by reacting a reaction mixture containing: at least one epoxy resin; at least one polyetherdiamine or polyethertriamine; at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN); and rubber particles having a core/shell structure. The invention also relates to methods for curing said compositions, to the cured adhesive compositions thus obtained, to the use thereof for bonding components and to the components thus obtained.

The invention relates to a composition comprising a sulfone-group containing resin obtainable by reaction of a polyamine containing at least one sulfone-group with a polyepoxide and optionally a hardener, as well as adhesives and coating compositions comprising said compositions having gas-barrier properties, methods for bonding substrates using said adhesives and the thus obtained articles as well as the use of the compositions described herein as adhesive or coatings having gas-barrier properties.

The present invention provides a resin composition for an acoustic matching layer which maintains uniform dispersibility of a hollow filler, can suppress bubble trapping, and is excellent in moldability and handleability. The resin composition for an acoustic matching layer, comprises a resin, a hollow filler, and a thixotropy imparting agent, wherein the resin composition has a viscosity measured using a B-type viscometer with rotor No. 4 at a rotation speed of 0.3 rpm at 25° C. of 1130 to 4000 Pa.Math.s, and has a thixotropy index expressed by the ratio (V1/V2) between a viscosity (V1) measured using a B-type viscometer with rotor No. 4 at a rotation speed of 0.3 rpm and a viscosity (V2) measured using a B-type viscometer with rotor No. 4 at a rotation speed of 1.5 rpm, at 50° C., of 3.0 to 5.0.