The present application is directed to dual curing composition which is both heat- and photo-curable, said composition comprising, based on the weight of the composition: from 20 to 90 wt. % of a) at least one epoxy methacrylate compound having at least two methacrylate groups; and, from 10 to 80 wt. % of b) at least one polythiol compound, wherein the composition is characterized in that the molar ratio of thiol(SH) groups to (meth)acrylate groups is in the range from 0.5:1 to 1:1.

An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.

An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.