A process for producing an epoxy-group terminated polyoxazolidinone comprising the copolymerization of a polyisocyanate compound (A) with two or more isocyanate groups with a polyepoxide compound (B) with two or more epoxy groups in the presence of a specific catalyst (C), wherein the molar ratio of the epoxy groups of the polyepoxide compound (B) to the isocyanate groups of the polyisocyanate compound (A) is from 2.6:1 and less than 25:1, and wherein the copolymerization is operated in the absence of an additional solvent (D-1) with a boiling point higher than 170° C., preferred higher than 165° C., more preferred higher than 160° C., and most preferred higher than 150° C. at 1 bar (absolute). The epoxy-group terminated polyoxazolidinones resulting from the process are also provided.

A composition for forming a resist underlayer film enables the formation of a desired resist pattern; and a method for forming a resist pattern using this resist underlayer film forming composition. A resist underlayer film forming composition contains an organic solvent and a polymer that has a structure represented by formula (1) or (2) at an end of the polymer chain. (In formula (1) and formula (2), X represents a divalent organic group; A represents an aryl group having 6-40 carbon atoms; R1 represents a halogen atom, an alkyl group having 1-40 carbon atoms or an alkoxy group having 1-40 carbon atoms; each of R2 and R3 independently represents a hydrogen atom, an optionally substituted alkyl group having 1-10 carbon atoms, an aryl group having 6-40 carbon atoms or a halogen atom; each of n1 and n3 independently represents an integer of 1-12; and n2 represents an integer of 0-11.)

A dispersion includes a hyperbranched polymer having latent crosslinking functionality and comprising the reaction product of: a partially neutralized, acid-functional resin; and an epoxy; and optionally, an effective amount of a crosslinking agent; wherein: the partially neutralized, acid-functional resin comprises the reaction product of a mixture of: a first acid-functional resin with a base and a second acid-functional resin; or a first and a second acid-functional resin with a base; the first acid-functional resin is not the same as the second acid-functional resin; at least one of the acid functional resins comprises a further functional group capable of Schiff-Base crosslinking after film formation; and the dispersion is a single pack waterborne polymer dispersion.

There is provided a photocurable composition including Component (A): epoxy compound, Component (B): acrylic ester compound, Component (C): isocyanate compound, Component (D): photobase generator, and Component (E): compound having a thiol group, in which Component (A) has two or more epoxy groups in one molecule, Component (B) has two or more acryloyl groups in one molecule, Component (C) has two or more isocyanate groups in one molecule, and Component (E) has two or more thiol groups in one molecule, and a ratio of a total mass of Component (A), Component (B), Component (C), and Component (D) to a mass of Component (E) is (Component (A)+Component (B)+Component (C)+Component (D)):Component (E)=74:26 to 20:80.

An apparatus and methods for using coatings for metal applications are disclosed. According to one embodiment, an article comprises a cured polymeric film having a first reaction product of a cationic photoinitiator and a compound suitable for cationic polymerization. The article has a second reaction product of a free-radical photoinitiator and a compound suitable for free-radical polymerization; The article has a metal substrate, wherein the cured polymeric film coats the metal substrate.

A process for producing an isocyanate-group terminated polyoxazolidinone comprising the copolymerization of a polyisocyanate compound (A) with two or more isocyanate groups with a polyepoxide compound (B) with two or more epoxy groups in the presence of a specific catalyst (C), wherein the molar ratio of the isocyanate groups of the polyisocyanate compound (B) to the epoxy groups of the polyepoxide compound (A) is larger than 2:1 and less than 25:1. The resulting isocyanate-group terminated polyoxazolidinones is also provided.

The present invention provides an epoxy resin composition containing an epoxy resin (A) having a viscosity at 25° C. of 1000 mPa.Math.s or less, an epoxy resin (B) having at least two epoxy groups that is other than the epoxy resin (A), a core-shell rubber particle (C), and an amine curing agent (D). The content of the epoxy resin (A) is in the range of 0.5 to 15 mass % relative to the total mass of (A), (B), (C), and (D), and the content of the core-shell rubber particle (C) is in the range of 1 to 10 mass % relative to the total mass of (A), (B), (C), and (D). This epoxy resin composition has low viscosity and good impregnation property into fibers and is capable of forming into a cured product having high heat resistance, high mechanical properties, and high water absorption resistance.

The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.

The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.

Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is a resin composition, cured product thereof, and methods of producing the composition and the product, wherein the composition includes: (A) multifunctional benzoxazine compound having at least two benzoxazine rings, (B) epoxy compound containing at least one epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) curing agent; wherein composition consisting of (A), (B), and (C) has weight-average molecular weight of 350 or more and 650 or less in terms of polystyrene. Additionally provided is a semiconductor device where semiconductor element is disposed in the cured product obtained by curing the composition containing components (A) to (C), and optionally components (D) and/or (E).