A multi-epoxidized biphenyl compound has the formula (I) below ##STR00001##
wherein R, R.sub.1, R.sub.2 and R.sub.3 are as defined in the description, as well as mixtures of at least two of the compounds. These multi-epoxidized biphenyl compounds are fully suitable as main constituents of thermosetting epoxy resins, i.e. as polyepoxides precursors. They are beneficial substitutes for bisphenol A diglycidyl ether.

An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties can be obtained. In addition, another object of the present invention is to provide a thermally conductive material formed of the composition for forming a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

A composition for forming a thermally conductive material of the present invention includes an epoxy compound, an inorganic substance, and a compound X containing one or more functional groups selected from the group consisting of an alkenyl group, an acrylate group, a methacrylate group, a silyl group, an acid anhydride group, a cyanate ester group, an amino group, a thiol group, and a carboxylic acid group, or having a polyamic acid structure, in which a content of the inorganic substance is 10% by mass or more with respect to a total solid content of the composition, and a content of the compound X is 10% by mass or more with respect to the total solid content of the composition.

Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.

The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.

Disclosed are methods of preparing a cross-linked polymeric polycarboxylic acid by cross-linking the polymeric polycarboxylic acid with cross-linking agent comprising a polyepoxide and a polyhydrazide. Also disclosed are the cross-linked polymeric polycarboxylic acids made by the process and water-absorbent polymer materials comprising the cross-linked polymeric polycarboxylic acids.

A photobase generator, includes a compound including a first skeleton represented by the following formula (a); and a second skeleton including a nitrogen atom bonding to a bonding position of the first skeleton to form an amide group, and a pyridine skeleton in addition to the nitrogen atom, in which the compound generates a base in which a hydrogen atom is bonded with the nitrogen atom of the second skeleton by light irradiation. In formula (a), G is a divalent aromatic group, and * represents the bonding position with the nitrogen atom.

##STR00001##

Provided is a hollow fiber membrane module that exhibits excellent durability even when a chemical such as a radical polymerizable compound is used for a separation or mixing process. Also provided is a method for producing the hollow fiber membrane module in a highly productive manner. More specifically, there is provided a hollow fiber membrane module at least including a tubular body, a cap, a hollow fiber membrane, and an end seal portion, wherein at least a liquid contacting portion of the end seal portion is sealed with a cured product of a curable resin composition including an epoxy resin, and wherein the epoxy resin includes a polyglycidyl ether of a polycondensate of an aromatic compound containing a phenolic hydroxyl group and an aromatic compound containing a formyl group and a phenolic hydroxyl group, and there is provided a method for producing the module.

Provided is a hollow fiber membrane module that exhibits excellent durability even when a chemical such as a radical polymerizable compound is used for a separation or mixing process. Also provided is a method for producing the hollow fiber membrane module in a highly productive manner. More specifically, there is provided a hollow fiber membrane module at least including a tubular body, a cap, a hollow fiber membrane, and an end seal portion, wherein at least a liquid contacting portion of the end seal portion is sealed with a cured product of a curable resin composition including an epoxy resin, and wherein the epoxy resin includes a polyglycidyl ether of a polycondensate of an aromatic compound containing a phenolic hydroxyl group and an aromatic compound containing a formyl group and a phenolic hydroxyl group, and there is provided a method for producing the module.

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.