The attenuation material composition disclosed in the present disclosure comprises a room temperature vulcanized silicone rubber, an epoxy resin, a first curing agent and a second curing agent, wherein the first curing agent comprises ethyl orthosilicate and dibutyltin oxide; and the weight ratio of the room temperature vulcanized silicone rubber to the epoxy resin is (0.1-1):1.

A bioelectrode includes an inorganic base material and a conductive layer covering the inorganic base material, in which the conductive layer has a polymer having moieties derived from a first compound having an epoxy group and an alkoxysilyl group, and at least one of an alkali metal ion and a Group 2 element ion supported in the polymer, and in the polymer, the moiety derived from the epoxy group is ring-opening polymerized, and the moiety derived from the alkoxysilyl group forms a siloxane bond.

A non-leaching mediator may include a polymer having a polymeric backbone, and a plurality of phenothiazine groups bonded to the polymeric backbone. The plurality of phenothiazine groups may include at least one of a phenothiazine group having the general formula (IV): ##STR00001##
and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded, and a phenothiazine group having the general formula (V): ##STR00002##
and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded.

The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 m or less.

A non-leaching mediator may include a polymer having a polymeric backbone, and a plurality of phenothiazine groups bonded to the polymeric backbone. The plurality of phenothiazine groups may include at least one of a phenothiazine group having the general formula (IV):

##STR00001##

and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded, and a phenothiazine group having the general formula (V):

##STR00002##

and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded.

The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.

A non-leaching mediator may include a polymer having a polymeric backbone, and a plurality of phenothiazine groups bonded to the polymeric backbone. The plurality of phenothiazine groups may include at least one of a phenothiazine group having the general formula (IV): ##STR00001##
and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded, and a phenothiazine group having the general formula (V): ##STR00002##
and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded.

The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.

Provided is a curing agent that includes a curing catalyst, and an aliphatic cyclic polyolefin resin disposed on a surface of the curing catalyst. The curing catalyst includes porous polyurea particles each bearing an aluminum chelating compound, or a water-insoluble catalyst powder having a solubility of 5% by mass or less relative to water.

The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5 C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.