C08G59/4007

ADHESIVE COMPOSITION, ADHESIVE FILM COMPRISING SAME, AND ORGANIC ELECTRONIC DEVICE COMPRISING SAME
20180171188 · 2018-06-21 ·

The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.

PROCESS FOR INTEGRATING THERMOSET AND THERMOPLASTIC POLYMERS
20180155587 · 2018-06-07 ·

A method for cross-linking an uncured or partially-cured epoxy resin system, the epoxy resin system including at least one epoxy compound, the epoxy compound including at least one glycidyl chemical group attached to at least one aniline chemical group, the process including:

providing the epoxy resin system with at least a portion of the epoxy compound in contact with a PVDF-containing polymer in a diffuse mixture or at an interface;

and cross-linking at least a portion of the epoxy compound with at least a portion of the PVDF-containing polymer, and in the same process step curing the epoxy resin system, to form a cured epoxy resin system having a cross-linked interface with a PVDF-containing polymer.

Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission

According to the present invention, a photosensitive resin composition for an optical waveguide contains a resin component and a photopolymerization initiator. The resin component has an absorbance of less than 0.03 as measured at 2960 cm.sup.1 by an attenuated total reflection measurement (ATR) method by means of a Fourier transform infrared spectrophotometer (FT-IR), and includes a polymerizable substituent-containing resin as a main component. Where the inventive optical waveguide photosensitive resin composition is used as a material for the optical waveguide, particularly as a core layer formation material for the optical waveguide, it is possible to reduce a loss, for example, by avoiding vibrational absorption occurring at an optical waveguide transmission light wavelength of 850 nm due to a resin skeleton.

CYCLIC CARBONATES

Compounds of the formula

##STR00001##

in which R.sup.1 is an organic radical having a (meth)acryloyl group and R.sup.2, R.sup.3, and R.sup.4 independently of one another are an H atom or a C1 to C10 alkyl group.

Polymer comprising a plurality of phenothiazine groups and methods of making the same

A non-leaching mediator may include a polymer having a polymeric backbone, and a plurality of phenothiazine groups bonded to the polymeric backbone. The plurality of phenothiazine groups may include at least one of a phenothiazine group having the general formula (IV): ##STR00001##
and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded, and a phenothiazine group having the general formula (V): ##STR00002##
and salts thereof, where n is about 9 and R represents the polymeric backbone to which the phenothiazine group is bonded.

A THERMALLY CURABLE EPOXY SYSTEM

A thermally curable epoxy system includes 94 to 99.98 wt % of an epoxide component, 0.01 to 5% wt% of a toughener, 0.005 to 1.5 wt % of a catalyst, and 0.005 to 1.5 wt % of a co-catalyst.

COLD CURING EPOXY RESIN PRIMER OR ADHESIVE

The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5 C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.

AMINE FOR RAPID-CURING EPOXY RESIN COMPOSITIONS

An amine of formula (I) which is particularly suitable for use as a curing agent for epoxy resins. The amine of formula (I) is devoid of non-incorporable toxic phenols, and is low-viscosity and pale in colour. It allows the production of easily-workable, low-emission or emission-free epoxy resin products which cure rapidly even at relatively low ambient temperatures thus obtaining a high degree of hardness and a nice surface with hardly any yellowing. This is particularly suited to use in floor or top coatings.

COATED LENS AND METHOD FOR MANUFACTURING THE SAME

A coated lens has a stamping which contains one or more ring-shaped focusing structures. A method for manufacturing such a coated lens is provided in which a coating composition is stamped. The coating composition includes at least one of an epoxide component and a (meth)acrylate component. The ring-shaped focusing structure(s) provide an additional power compared to the central clear zone of the coated lens.

Resin composition, prepreg, and laminate

To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.