The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.

The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.

Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.

This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

Methods and materials for sand control in water injection sites are disclosed. Proppant particles may be coated with some particles coated with a solid epoxy and other proppant particles coated with a solid epoxy curative (such as amine, hydroxyl, carboxyl, anhydride) that would bind the particles through an epoxy reaction. The invention may be advantageous for forming underground structures useful in the extraction of hydrocarbons.

Methods and materials for sand control in water injection sites are disclosed. Proppant particles may be coated with some particles coated with a solid epoxy and other proppant particles coated with a solid epoxy curative (such as amine, hydroxyl, carboxyl, anhydride) that would bind the particles through an epoxy reaction. The invention may be advantageous for forming underground structures useful in the extraction of hydrocarbons.

Provided is a polyurethane-modified epoxy resin composition having satisfactory operability of processing, such as casting or impregnation, in a composition state. The epoxy resin composition includes, as essential components, the following components (A) to (D): (A) a low-concentration polyurethane-modified epoxy resin containing a polyurethane having an epoxy resin added to each of both terminals thereof and/or one terminal thereof; (B) a polyurethane-unmodified epoxy resin that is liquid at 30 C.; (C) a solid epoxy resin having a bisphenol structure, the resin having a glass transition temperature or a melting point of 50 C. or more; and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof, wherein the epoxy resin composition includes the component (A) at from 3.0 wt % to 30.0 wt %, and the component (C) at from 0.1 wt % to 40.0 wt % with respect to the total of the components (A) to (D).

Provided is a polyurethane-modified epoxy resin composition having satisfactory operability of processing, such as casting or impregnation, in a composition state. The epoxy resin composition includes, as essential components, the following components (A) to (D): (A) a low-concentration polyurethane-modified epoxy resin containing a polyurethane having an epoxy resin added to each of both terminals thereof and/or one terminal thereof; (B) a polyurethane-unmodified epoxy resin that is liquid at 30 C.; (C) a solid epoxy resin having a bisphenol structure, the resin having a glass transition temperature or a melting point of 50 C. or more; and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof, wherein the epoxy resin composition includes the component (A) at from 3.0 wt % to 30.0 wt %, and the component (C) at from 0.1 wt % to 40.0 wt % with respect to the total of the components (A) to (D).

An adhesive, more particularly a thermally curable, meltable, preferably pressure-sensitive adhesive, which is curable thermally from a temperature of 110 C., is storage-stable for approximately one month at 60 C. and longer than one year at 23 C., and an adhesive tape produced therefrom, comprising an epoxide-functionalized acrylonitrile/butadiene copolymer having on average more than 1.5 epoxide groups per molecule, and the ground reaction product of phthalic anhydride and diethylenetriamine, for use in the automotive industry both in bodyshell construction on oiled metal sheets and in the coating line on cathodically electrocoated or otherwise-coated metal sheets, for bonding and/or sealing, for example for hem fold bonding, for hem fold sealing, for seam sealing, for underseal bonding, for hole stopping, and much more.