A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm.sup.3.

An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.

A composition including an amidoamine curing agent composition or a polyamide curing agent composition are disclosed. The composition includes the reaction products of (1) an amine component including at least one multifunctional amine of structure (I): ##STR00001##
wherein each R is independently H or CH.sub.2CH.sub.2CH.sub.2NH.sub.2; R.sub.1 is H, CH.sub.3CH.sub.2CH.sub.2N, C1-C21 alkyl, or C1-C21 alkenyl; n is 2; and m is 1 or 2, with (2) a fatty acid or ester component selected from the group consisting of a dimer fatty acid or ester component, a monofunctional fatty acid or ester component, and combinations thereof. The amidoamine curing agent composition remains as liquid at ambient temperature.

A composition including an amidoamine curing agent composition or a polyamide curing agent composition are disclosed. The composition includes the reaction products of (1) an amine component including at least one multifunctional amine of structure (I): ##STR00001##
wherein each R is independently H or CH.sub.2CH.sub.2CH.sub.2NH.sub.2; R.sub.1 is H, CH.sub.3CH.sub.2CH.sub.2N, C1-C21 alkyl, or C1-C21 alkenyl; n is 2; and m is 1 or 2, with (2) a fatty acid or ester component selected from the group consisting of a dimer fatty acid or ester component, a monofunctional fatty acid or ester component, and combinations thereof. The amidoamine curing agent composition remains as liquid at ambient temperature.

There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: ##STR00001##
wherein R.sup.1 to R.sup.3 each independently are a hydrogen atom or methyl group, and L.sup.1 to L.sup.3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: ##STR00001##
wherein R.sup.1 to R.sup.3 each independently are a hydrogen atom or methyl group, and L.sup.1 to L.sup.3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.

The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of 45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of 45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25 C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.

The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25 C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.