C08G59/50

Thermoplastic polymer-based composite material and preparation method thereof

A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or oligomer of an epoxy resin, a bismaleimide resin, and a bifunctional amine (calculated based on active hydrogen), and then performing an in-situ polymerization. The thermoplastic polymer-based composite material has excellent impregnation effect, excellent secondary processing performance, relatively high heat resistance, excellent flame retardancy, and mechanical properties, and excellent comprehensive performance.

Thermoplastic polymer-based composite material and preparation method thereof

A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or oligomer of an epoxy resin, a bismaleimide resin, and a bifunctional amine (calculated based on active hydrogen), and then performing an in-situ polymerization. The thermoplastic polymer-based composite material has excellent impregnation effect, excellent secondary processing performance, relatively high heat resistance, excellent flame retardancy, and mechanical properties, and excellent comprehensive performance.

THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN CURED PRODUCT, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL
20230054021 · 2023-02-23 ·

A thermosetting resin composition contains at least: [A] a thermosetting resin; [B] a curing agent; and [C] polyamide particles satisfying following (c1) to (c6): (c1) a melting point of polyamide resin constituting the polyamide particles is 200 to 300° C.; (c2) a crystallization temperature of the polyamide resin constituting the polyamide particles is 150° C. to 250° C.; (c3) a number average particle size of the polyamide particles is 1 to 100 μm; (c4) a sphericity of the polyamide particles is 80 to 100; and (c5) the linseed oil absorption of the polyamide particles is 10 to 100 mL/100 g. A thermosetting resin composition of the present invention enables suitable production of a fiber-reinforced composite material having sufficient compressive strength after impact and wet heat compression performance.

EPOXY RESIN COMPOSITION, GAS BARRIER MULTILAYER BODY, RETORT FOOD PACKAGING MATERIAL, PACKAGING MATERIAL FOR DEODORIZATION OR AROMA RETENTION, HEAT SHRINKABLE LABEL AND METHOD FOR PRODUCING SAME, HEAT SHRUNK LABEL AND BOTTLE HAVING SAME

An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a CO.sub.2 transmission prevention method.

ADHESIVE COMPOSITIONS FOR ANCHORING FASTENERS

An ultraviolet-curable (UV-curable) adhesive composition is disclosed. The adhesive composition comprises: A) an epoxy curing agent component; B) a microencapsulated epoxy resin component; C) an expansion agent component; D) a binder component; and E) a photoinitiator component. The adhesive composition is useful for forming an adhesive. In various embodiments, the adhesive composition is in the form of a stick. The adhesive composition is useful for securing a fastener (e.g. in a borehole).

THERMOSETTING LIQUID COMPOSITION FOR ENCAPSULANT IN ORGANIC LIGHT-EMITTING DEVICE
20230054116 · 2023-02-23 ·

Disclosed is a liquid composition for an encapsulant of an organic light-emitting device. The liquid composition is free of a physical and chemical hygroscopic agent (getter) but includes a binder material having high hygroscopicity including an aliphatic 4-functionalized epoxy-based compound. Thus, the liquid composition for the encapsulant may be rapidly cured at low temperature and may secure excellent storage stability under a high temperature environment.

THERMOSETTING LIQUID COMPOSITION FOR ENCAPSULANT IN ORGANIC LIGHT-EMITTING DEVICE
20230054116 · 2023-02-23 ·

Disclosed is a liquid composition for an encapsulant of an organic light-emitting device. The liquid composition is free of a physical and chemical hygroscopic agent (getter) but includes a binder material having high hygroscopicity including an aliphatic 4-functionalized epoxy-based compound. Thus, the liquid composition for the encapsulant may be rapidly cured at low temperature and may secure excellent storage stability under a high temperature environment.

RECOVERY AND REUSE OF ACID DIGESTED AMINE/EPOXY-BASED COMPOSITE MATRICES

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

RECOVERY AND REUSE OF ACID DIGESTED AMINE/EPOXY-BASED COMPOSITE MATRICES

A method for recycling matrix residues includes steps of degrading a target epoxy to form matrix residues, collecting the matrix residues, and adding the matrix residues into a polymer-forming formulation. Characteristically, the polymer-forming formulation includes multifunctional anhydride monomers and polyfunctional co-reactant monomers.

Rubber composition comprising an epoxide resin and a specific amine hardener

A rubber composition exhibiting an improved processability/stiffness compromise is based on at least a diene elastomer, a reinforcing filler, a crosslinking system, between 1 and 30 parts by weight per hundred parts by weight of elastomer, phr, of an epoxy resin and between 1 and 15 phr of a specific amine-comprising hardener comprising in particular at least two primary amine functional groups located on at least one six-membered aromatic ring and at least two Ri radicals, which are identical or different, selected from the group consisting of linear or branched C.sub.1-C.sub.6 alkyl radicals, halogens, and ethers, tertiary amines, thioethers, ketones, esters and amides, substituted by linear or branched C.sub.1-C.sub.6 alkyl radicals, the said ring not comprising a hydrogen atom located in the ortho position with respect to the primary amine functional groups.