Patent classifications
C08G59/62
Curing agent for epoxy resins
The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.
Curing agent for epoxy resins
The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.
Crosslinkable composition and crosslinked product
A crosslinkable composition containing: a liquid monocyclic olefin ring-opened polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000 to 50,000; and a crosslinkable compound (B) having, in the molecule, two or more functional groups reactive with the reactive group at the polymer chain end of the monocyclic olefin ring-opened polymer (A).
Crosslinkable composition and crosslinked product
A crosslinkable composition containing: a liquid monocyclic olefin ring-opened polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000 to 50,000; and a crosslinkable compound (B) having, in the molecule, two or more functional groups reactive with the reactive group at the polymer chain end of the monocyclic olefin ring-opened polymer (A).
Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing
Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R.sup.5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. ##STR00001##
Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing
Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R.sup.5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. ##STR00001##
Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.
Methods of preparing compositions for containers and other articles and methods of using same
This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.
RESIN COMPOSITION AND MOLDED ARTICLE
Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.
Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).