A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

Provided is a high-sensitive photosensitive resin composition which contains a black colorant and by which development and pattern formation are possible even with a low exposure amount. A positive-type photosensitive resin composition according to one embodiment contains: a first resin (A) having a plurality of phenolic hydroxyl groups, at least some of which are protected with an acid-labile group; a second resin (B) having an epoxy group and a phenolic hydroxyl group; at least one colorant (C) selected from the group consisting of a black dye and a black pigment; and a photoacid generator (D).

Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

Provided is an electrolytic capacitor with a resin layer, in which an increase in ESR over time is suppressed. A electrolytic capacitor includes a capacitor element including an anode foil, a cathode foil, and electrolytic solution, a case housing the capacitor element, a sealing member sealing the case, and a resin layer arranged in the vicinity of the sealing member. The resin layer arranged in the vicinity of the sealing member includes epoxy resin composition without ester bond.

Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30° C. to 200° C. under conditions of a temperature increase rate of 10° C./min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100° C. and equal to or lower than 163° C., and a half-value width of a maximum heat release peak is equal to or higher than 5° C. and equal to or lower than 25° C.

An epoxy resin represented by the following formula (1), in which in a total amount of an epoxy compound represented by n=1 in the epoxy resin of the above formula, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage.

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The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.

A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).

A method for strengthening metal structure, including steps: i) mixing two-component epoxy resin composition; ii) applying composition to metal structure surface, or onto strengthening element, or both; iii) contacting applied epoxy resin composition with strengthening element surface and/or metal structure surface wherein composition forms interlayer between metal structure and strengthening element, and iv) curing epoxy resin composition at 100° C. or below; wherein two-component epoxy resin composition contains: first component between 10-50 wt.-% of at least one epoxy resin contains on average more than one epoxy group per molecule; second component between 5-30 wt.-% of hardener for epoxy resins; between 3-25 wt.-% of at least one impact strength modifier in one or both components; between 15-80 wt.-% of at least one filler in one or both components; and wherein two-component epoxy resin composition exhibits after curing Elastic Modulus at least 2500 MPa, and Impact Peel Strength at least 15 N/mm.