The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

One-component (1K) adhesive compositions (“PEEP” compositions) and a process for making them are disclosed. A polyepoxide is reacted with a polyether polyol composition, a polyester polyol composition, or both in the presence of a heat-activated Lewis acid catalyst at a temperature within the range of 100° C. to 220° C. for a time effective to cure the adhesive. The compositions are storage-stable under ambient conditions. Compared with conventional epoxy compositions, the 1K PEEP compositions offer improved room temperature lap shear strength, better resilience, and higher elongation. The 1K PEEP systems deliver a desirable balance of physical and mechanical properties while avoiding polyisocyanates and polyamine crosslinkers.

One-component (1K) adhesive compositions (“PEEP” compositions) and a process for making them are disclosed. A polyepoxide is reacted with a polyether polyol composition, a polyester polyol composition, or both in the presence of a heat-activated Lewis acid catalyst at a temperature within the range of 100° C. to 220° C. for a time effective to cure the adhesive. The compositions are storage-stable under ambient conditions. Compared with conventional epoxy compositions, the 1K PEEP compositions offer improved room temperature lap shear strength, better resilience, and higher elongation. The 1K PEEP systems deliver a desirable balance of physical and mechanical properties while avoiding polyisocyanates and polyamine crosslinkers.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a trivalent or higher polyvalent phenol type epoxy compound (B), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a trivalent or higher polyvalent phenol type epoxy compound (B), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.

##STR00001##

In the formula, R.sup.1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R.sup.2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R.sup.2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.

##STR00001##

In the formula, R.sup.1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R.sup.2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R.sup.2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.