An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (T.sub.g), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer 6a or 6b provided on at least one surface of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 μm, wherein the polyamide resin particles 4 include a particle made of a polyamide 11.

A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R.sup.1, R.sup.2 and R.sup.3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7. ##STR00001##

An additive composition includes a specific amount of α-methylstyrenated phenol, can be mixed with a main material part or curing agent part for paint, and can suppress the occurrence of a discoloration issue.

There is provided herein a curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermoplastic and/or thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.

The present invention provides a curable resin composition, a cured product of which has a small change in heat resistance after receiving a thermal history and a low thermal expansion property; a cured product of the curable resin composition; a printed circuit board having a small change in heat resistance; and an epoxy resin which imparts the characteristics described above. The epoxy resin is an epoxy resin which is obtained by polyglycidyl etherification of a reaction product formed from ortho-cresol, a β-naphthol compound, and formaldehyde and which includes as a necessary component, a dimer (x2, formula (1)), a trifunctional compound (x3, formula (2)), and a tetrafunctional compound (x4, formula (3)). The total content of those components is 65% or more in terms of the area rate in GPC measurement. ##STR00001##

A semiconductor encapsulation material is used to fabricate a semiconductor device. The semiconductor device includes a semiconductor chip and an encapsulating portion. The encapsulating portion is made of a cured product of the semiconductor encapsulation material. The encapsulating portion encapsulates the semiconductor chip. A stress index (SI), given by the following Formula (1), of the semiconductor encapsulation material is equal to or more than 8500. If a volume of the semiconductor chip is represented by Vc and a total volume of the semiconductor chip and the encapsulating portion is represented by Va, the volume Vc and the total volume Va satisfy the following Formula (2). In Formula (1), E′ (T) represents a storage modulus, CTE (T) represents a coefficient of thermal expansion, and Mold temp. represents a molding temperature.

[00001]$\begin{array}{cc}\mathrm{SI}={\int }_{35°C.}^{\mathrm{Moldtemp}.}\left[E^{\prime }\left(T\right)\times \mathrm{CTE}\left(T\right)\right]\mathrm{dT}& \left(1\right)\\ \frac{\mathrm{Vc}}{\mathrm{Va}}\geqq 0.3.& \left(2\right)\end{array}$

Disclosed is a method for producing a prepreg, the prepreg having: a reinforcing fiber layer including reinforcing fibers and a resin composition containing component (A), component (B), and component (C), the reinforcing fibers being impregnated with the resin composition in between the fibers; and a surface fiber layer provided on the surface of the reinforcing fiber layer and including a fabric including polyamide fibers and a resin composition containing component (A), component (B), and component (C), the polyamide fibers being impregnated with the resin composition in between the fibers. The method for producing a prepreg includes a disposition step of disposing the fabric on the surface of a reinforcing fiber base material and an impregnation step of supplying a resin composition to the reinforcing fiber base material and impregnating the reinforcing fibers with the resin composition in between the fibers.

An epoxy resin composition includes a polyol (A) having a hydroxyl value of 130 to 600 mgKOH/g, an epoxy resin (B), an amine curing agent (C), and a toughener (D). The epoxy resin composition may satisfy both 0.1≤Wt.sup.2/Wp≤8.0 and 0.1≤Wp≤8.0, where Wp represents the polyol (A) content of the composition in % by weight and Wt represents the toughener (D) content of the composition in % by weight, relative to a total amount of the polyol (A), the epoxy resin (B), the amine curing agent (C), and the toughener (D).