Methods and materials for sand control in water injection sites are disclosed. Proppant particles may be coated with some particles coated with a solid epoxy and other proppant particles coated with a solid epoxy curative (such as amine, hydroxyl, carboxyl, anhydride) that would bind the particles through an epoxy reaction. The invention may be advantageous for forming underground structures useful in the extraction of hydrocarbons.

Methods and materials for sand control in water injection sites are disclosed. Proppant particles may be coated with some particles coated with a solid epoxy and other proppant particles coated with a solid epoxy curative (such as amine, hydroxyl, carboxyl, anhydride) that would bind the particles through an epoxy reaction. The invention may be advantageous for forming underground structures useful in the extraction of hydrocarbons.

Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.

Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.

A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 40 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises ether in the backbone thereof.

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

A composition that forms an insulating layer contains an epoxy-thiol-based binder. Because the expansion rate of the composition is relatively high, coatings having the layer thickness required for the relevant fire resistance duration can be applied in a simple and rapid manner, and it is possible to reduce the layer thickness to a minimum while still achieving a good insulating effect. The composition is particularly suitable for fire-protection, in particular as a coating for metal and non-metal substrates, e.g., steel components such as supports, beams, and truss members, to increase the fire resistance duration thereof.

A composition that forms an insulating layer contains an epoxy-thiol-based binder. Because the expansion rate of the composition is relatively high, coatings having the layer thickness required for the relevant fire resistance duration can be applied in a simple and rapid manner, and it is possible to reduce the layer thickness to a minimum while still achieving a good insulating effect. The composition is particularly suitable for fire-protection, in particular as a coating for metal and non-metal substrates, e.g., steel components such as supports, beams, and truss members, to increase the fire resistance duration thereof.

The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.