Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

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A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.

The present application discloses a frame sealant and its preparation method and display panel. The frame sealant of the present application includes frame sealant glue and conductive fibers dispersed in the frame sealant glue, and the conductive fibers have a three-dimensional helical structure. The frame sealant of the present application has excellent electrical conductivity, high packaging quality, excellent toughness and packaging bonding strength after curing, and improves the anti-separation ability of the two substrates of the box. The preparation method of the frame sealant of the present application can ensure that the prepared frame sealant has stable performance and high efficiency. The display panel contains the frame sealant of the present application, with stable display and long service life.

Disclosed is a liquid composition for an encapsulant of an organic light-emitting device. The liquid composition is free of a physical and chemical hygroscopic agent (getter) but includes a binder material having high hygroscopicity including an aliphatic 4-functionalized epoxy-based compound. Thus, the liquid composition for the encapsulant may be rapidly cured at low temperature and may secure excellent storage stability under a high temperature environment.

A curable, one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two primary thiol groups; a nitrogen-containing catalyst for the epoxy resin; and a substituted barbituric acid soluble in the one-part epoxy/thiol resin composition.

An epoxy resin composition comprising the following components (A) to (E). Component (A) is a compound containing two or more epoxy groups. Component (B) is phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms. Component (C) is an oxetane compound. Component (D) is a thiol curing agent. Component (E) is a curing accelerator.

An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R.sup.1 is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R.sup.2 and R.sup.3 are each independently a group selected from hydrogen and C1-C6 alkyls.)

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A solid resin molding material according to the present invention includes a thermosetting resin (A), a curing agent (B), a carboxylic acid-based dispersant (C), and magnetic particles (D).

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.