Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component.

Disclosed are curable coating compositions, and methods of cathodic corrosion protection using the compositions. For example, a curable coating composition comprising a mixed salt of magnesium thiodialkanoate, and a method for applying the coating composition, which when applied onto a steel or other ferrous substrate provides an anticorrosive coating, effective for improving resistance to cathodic disbondment.

Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.

An epoxy resin composition for a fiber-reinforced composite material, containing at least components [A], [B], [C], [D], and [E], wherein the epoxy resin composition when cured has a glass transition temperature greater than 220 C. and a storage modulus, as defined by a specific method, less than 35 MPa, as determined from an elastic shear modulus measured at a temperature of at least 35 C. higher than the glass transition temperature, wherein the components [A], [B], [C], [D], and [E] are: [A] at least one naphthalene-based epoxy resin having an EEW between 190 and 260 g/mol; [B] at least one epoxy resin having a functionality of three or more; [C] at least one amine curing agent; [D] at least one latent acid catalyst; and [E] at least one cycloaliphatic epoxy resin. This epoxy resin composition is useful in the molding of fiber-reinforced composite materials. More particularly, it is possible to offer an epoxy resin composition for a fiber-reinforced composite material where the cured material obtained by heating has high levels of heat resistance and microcrack resistance.

A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.

The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance.

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(In the Formula (1), R.sup.1 to R.sup.18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.)

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a hydroxyl-containing compound having a molecular weight of 500 or more; (C) a photo-cationic polymerization initiator; and (D) a light-shielding material.

A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.