Patent classifications
C08G59/687
FAST-CURING EPOXY SYSTEMS
The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brosted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.
Curable composition for lens, lens and optical device
Provided is a curable composition capable of giving a lens that has excellent transfer accuracy from a mold and offers heat resistance and optical properties at excellent levels. The curable composition according to the present invention for lens formation contains a cycloaliphatic epoxide (A) represented by Formula (a), a cationic-polymerization initiator (B), and a polysiloxane (C) represented by Formula (c). The curable composition contains the polysiloxane (C) in an amount of 0.01% to 5% by weight based on the total amount of the curable composition. The curable composition according to the present invention for lens formation may further contain a siloxane compound (D) containing two or more epoxy groups per molecule. ##STR00001##
Fluorinated compound, curable composition and cured product
To provide a fluorinated compound capable of obtaining a cured product which is excellent in heat resistance and mold release and has a high Abbe number; a curable composition containing such a compound; and a cured product which is excellent in heat resistance and mold release and has a high Abbe number. The fluorinated compound is represented by the following formula (A):
[ZOCH.sub.2CF.sub.2CF.sub.2CF.sub.2OCFHCF.sub.2X].sub.nQ(A)
where n is an integer of at least 1, Q is a n-valent organic group, X is O, NH or S, and Z is a group having at least one polymerizable functional group.
ENCAPSULATING COMPOSITION
The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.
Curable Composition
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.
Uspension polymerization compositions, methods and uses thereof
The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
Hard coating film using composition including epoxy siloxane resin and preparing method thereof
The present disclosure relates to a hard-coating cured material which contains a siloxane resin component including an epoxy group and a preparing method of the hard-coating cured material. Especially, by using a special polymerization method like a cationic polymerization and a moisture-heat treatment, it is possible to provide a hard-coating film having both superior flexibility and high surface hardness that cannot be obtained from conventional coating compositions.
Treated porous material
A treated cellulosic material comprising a cellulosic material having a porous structure defining a plurality of pores, at least a portion of the pores containing a treating agent comprising a cured low viscosity epoxy resin. The present disclosure further describes a method for preparing a treated cellulosic material comprising (a) providing a cellulosic material; and (b) a first treatment protocol comprising impregnating the cellulosic material with a liquid epoxy resin.
Systems and Methods for Enabling Communication Between USB Type-C Connections and Legacy Connections Over an Extension Medium
Techniques for supporting USB and video communication over an extension medium are provided. In some embodiments, an upstream facing port device (UFP device) is coupled to legacy connectors of a host device, and a downstream facing port device (DFP device) is coupled to a USB Type-C receptacle of the sink device that may provide both USB and DisplayPort information. The UFP device and DFP device communicate to properly configure the USB Type-C connection for use in the extension environment. In some embodiments, a source device is coupled to the UFP device via a USB Type-C connection, and legacy video and USB devices are coupled to the DFP device. The UFP device and DFP device again communicate to cause the source device to properly configure the USB Type-C connection for use in the extension environment.
Electrical Insulation System Based on Epoxy Resins for Generators and Motors
Disclosed is an anhydride-free insulation system for current-carrying construction parts of an electric engine which comprises:
(A) a mica paper or mica tape for wrapping parts of said electric engine that are potentially current-carrying during operation of the engine, which mica paper or mica tape is impregnable via vacuum pressure impregnation with a thermally curable epoxy resin formulation and comprises one or more thermally activatable sulfonium salt initiators for the homopolymerisation of the epoxy resins present in said said thermally curable epoxy resin formulation or a mixture thereof in an amount sufficient to homopolymerize the epoxy resin taken up by the mica paper or mica tape and the construction part of the engine during the vacuum pressure impregnation step;
(B) a thermally curable bath formulation for the vacuum pressure impregnation comprising (i) a polyglycidyl ether or a mixture thereof, and (ii) a cycloaliphatic epoxy resin comprising at least two epoxy groups, which are fused to a cycloaliphatic ring, or a mixture thereof,
which formulation is substantially or, preferably, entirely free of thermally activatable curing initiators for the epoxy resin formulation.