A composition for forming a thermally conductive material contains a compound represented by General Formula (1), a phenolic compound, and an inorganic substance, in which a content of the compound represented by General Formula (1) is 30.0% by mass or greater with respect to a total organic solid content,

(X—Z.sup.1—).sub.m-A-(—Z.sup.2—Y).sub.n  (1).

Provided are a window film composition, a flexible window film formed therefrom and a flexible display device containing the same, the composition comprising: a crosslinking agent represented by RX-X—Z—Y-RY (RX and RY each independently represent a glycidyl group, a glycidyl group-containing functional group, an alicyclic epoxy group or an alicyclic epoxy group-containing functional group); an epoxy group-containing siloxane resin; and an initiator.

There is provided an epoxy composition which has difficulty in precipitating a crystal during storage, is homogeneous and can be stored for a long period; and a cured product of the composition having excellent transparency, heat resistance, and light resistance can be obtained on curing. An α-type tris-(2,3-epoxypropyl)-isocyanurate crystal including β-type tris-(2,3-epoxypropyl)-isocyanurate in the crystal in a ratio of 2% by mass to 15% by mass. A method for producing the α-type tris-(2,3-epoxypropyl)-isocyanurate crystal including step (i) separating β-type tris-(2,3-epoxypropyl)-isocyanurate contained in a tris-(2,3-epoxypropyl)-isocyanurate solution from the solution as a solid to obtain a crystal with an increased content ratio of α-type tris-(2,3-epoxypropyl)-isocyanurate.

A powder coating material used for a powder coating method including a step of immersing a coil end of a coil, which includes a conductor portion coated with an insulating coating and an exposed portion where the conductor portion is exposed from the insulating coating, in a fluidized chamber in which a powder coating material flows, and adhering a melt of the powder coating material to an outside of the exposed portion, the powder coating material containing a particulate thermosetting resin composition. The thermosetting resin composition contains an epoxy resin, and a curing agent.

Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: ##STR00001##
where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

An object of the present invention is to provide a composition for forming a thermally conductive material, from which a thermally conductive material having excellent thermally conductive properties and adhesiveness can be obtained. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer. A composition for forming a thermally conductive material of the present invention contains a thermosetting compound A, boron nitride particles B containing boron nitride and having an average particle diameter of 25.0 μm or more, and boron nitride particles C containing boron nitride and having an average particle diameter of 15.0 μm or less, in which an oxygen atom concentration on a surface of the boron nitride particles C detected by X-ray photoelectron spectroscopic analysis is 1.5 atomic % or more.

Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.