A light emitting device is manufactured by bonding an LED element on a wiring board using an anisotropic conductive adhesive. In the manufacture, the anisotropic conductive adhesive is disposed on the wiring board, and the LED element is disposed thereon. A polymerizable epoxy-modified silicone resin and a metal chelate compound are contained in the anisotropic conductive adhesive in advance. A pressing unit is pressed against the LED element for a certain pressing time, while the temperature of the wiring board is kept at 160 C. or higher and 210 C. or lower, and the temperature of the pressing unit is set lower than that of the wiring board. Since the reaction between the epoxy-modified silicone resin and the metal chelate compound occurs at a low temperature, the LED element is temporarily connected to the wiring board without collapse of a fluorescent layer.

An aluminum-chelate-based latent curing agent is capable of showing excellent solvent resistance and excellent storage stability at room temperature without impairing low temperature rapid curability of resin composition, when preparing one-pack type thermosetting epoxy resin composition by blending aluminum-chelate-based latent curing agent holding aluminum-chelating agent on porous resin particles obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization into alicyclic epoxy resin showing extremely high cationic polymerizability. Aluminum-chelate-based latent curing agent for curing thermosetting epoxy resin is configured such that aluminum-chelating agent is held on porous resin obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization, and that surface activity inhibition treatment is performed by epoxy-alkoxy-silane coupling agent.

An aluminum-chelate-based latent curing agent is capable of showing excellent solvent resistance and excellent storage stability at room temperature without impairing low temperature rapid curability of resin composition, when preparing one-pack type thermosetting epoxy resin composition by blending aluminum-chelate-based latent curing agent holding aluminum-chelating agent on porous resin particles obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization into alicyclic epoxy resin showing extremely high cationic polymerizability. Aluminum-chelate-based latent curing agent for curing thermosetting epoxy resin is configured such that aluminum-chelating agent is held on porous resin obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization, and that surface activity inhibition treatment is performed by epoxy-alkoxy-silane coupling agent.

Provided is a curing agent that includes a curing catalyst, and an aliphatic cyclic polyolefin resin disposed on a surface of the curing catalyst. The curing catalyst includes porous polyurea particles each bearing an aluminum chelating compound, or a water-insoluble catalyst powder having a solubility of 5% by mass or less relative to water.

Provided is a curing agent that includes a curing catalyst, and an aliphatic cyclic polyolefin resin disposed on a surface of the curing catalyst. The curing catalyst includes porous polyurea particles each bearing an aluminum chelating compound, or a water-insoluble catalyst powder having a solubility of 5% by mass or less relative to water.

An impregnating resin, e.g., a catalytically hardenable impregnating resin for the conductor of an electrical machine, may include at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, e.g., for cationic, anionic or coordinate polymerization of the impregnating resin. The properties of the impregnating resin or use thereof may be improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin may be part of a main insulation of a conductor arrangement, which may in turn be installed in an electrical coil or other electrical machine.

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

Provided is a thermosetting epoxy resin composition, including: an epoxy resin; a latent curing agent which is porous particles formed of a polyurea resin and supporting an aluminum chelate; and boric acid.