C08G59/72

POLYOL-EPOXIDE POLYMERS FOR NVH DAMPING APPLICATIONS

Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of −50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

POLYOL-EPOXIDE POLYMERS FOR NVH DAMPING APPLICATIONS

Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of −50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications.

THERMOSETTING EPOXY RESIN COMPOSITION, CIRCUT BOARD LAMINATE, METAL-BASED CIRCUT BOARD, AND POWER MODULE
20210403702 · 2021-12-30 · ·

According to an embodiment, a thermosetting epoxy resin composition including an epoxy resin, an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound is provided. The aromatic amine compound is represented by the following general formula (1) (where R.sub.1 represents an alkyl group, m represents an integer of 2 or more, n represents an integer of 0 or more, and m and n satisfy m+n≤6, and when n is an integer of 2 or more, a plurality of R.sub.1 may be the same as or different from each other).

##STR00001##

PHOTOCATIONICALLY CURABLE COMPOSITION AND DENTAL CURABLE COMPOSITION
20230320940 · 2023-10-12 ·

To prevent gelling even during storage for a long time period under high temperature or room temperature, and to achieve rapid curing under a room-temperature condition at the time of photoirradiation, provided are a photocationically curable composition containing a cationically polymerizable monomer and photoacid generators, and being substantially free of a hydrogen ion scavenger, wherein the photoacid generators include: at least one kind of photoacid generator selected from a photoacid generator formed of an ion pair whose anion is a noncoordinating anion, and a photoacid generator formed of a zwitterionic compound whose anionic moiety is a noncoordinating anionic moiety; and at least one kind of photoacid generator selected from a photoacid generator formed of an ion pair whose anion is not a noncoordinating anion and a photoacid generator formed of a zwitterionic compound whose anionic moiety is not a noncoordinating anionic moiety, and a dental curable composition using the same.

PHOTOCATIONICALLY CURABLE COMPOSITION AND DENTAL CURABLE COMPOSITION
20230320940 · 2023-10-12 ·

To prevent gelling even during storage for a long time period under high temperature or room temperature, and to achieve rapid curing under a room-temperature condition at the time of photoirradiation, provided are a photocationically curable composition containing a cationically polymerizable monomer and photoacid generators, and being substantially free of a hydrogen ion scavenger, wherein the photoacid generators include: at least one kind of photoacid generator selected from a photoacid generator formed of an ion pair whose anion is a noncoordinating anion, and a photoacid generator formed of a zwitterionic compound whose anionic moiety is a noncoordinating anionic moiety; and at least one kind of photoacid generator selected from a photoacid generator formed of an ion pair whose anion is not a noncoordinating anion and a photoacid generator formed of a zwitterionic compound whose anionic moiety is not a noncoordinating anionic moiety, and a dental curable composition using the same.

Low-modulus high-adhesion silane-modified polyether sealant for prefabricated building, and preparation method therefor

A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained. The two-composition polyether sealant system has good compatibility, greatly improves the adhesive properties thereof, achieves a good adhesion and waterproofing effect without needing to be used with a priming coating, and also avoids the risk of water leakage caused by misoperation in the applying of the priming coating existing in the prior art.

Low-modulus high-adhesion silane-modified polyether sealant for prefabricated building, and preparation method therefor

A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained. The two-composition polyether sealant system has good compatibility, greatly improves the adhesive properties thereof, achieves a good adhesion and waterproofing effect without needing to be used with a priming coating, and also avoids the risk of water leakage caused by misoperation in the applying of the priming coating existing in the prior art.

CURABLE COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL
20220259372 · 2022-08-18 · ·

Provided is a curable composition that forms a fiber-reinforced composite material having excellent heat resistance. The curable composition of the present disclosure includes a compound (1), a compound (2), and a Lewis acid catalyst, the compound (1) being represented by Formula (1), the compound (2) being represented by Formula (2), and the weight ratio of the content of the compound (1) to the content of the compound (2) is from 10/90 to 40/60. The Lewis acid catalyst is preferably a catalyst of a base and a Lewis acid, and particularly preferably is a complex formed by the Lewis acid and an amine. The Lewis acid is represented by Formula (3): MX.sub.n (3), where M represents a metal atom selected from B, Al, Fe, Sn, Si, Zn, and Ti, X represents a halogen atom, and n indicates an oxidation number of the metal atom.

##STR00001##

Impregnation resin mixture

The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidized halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.

Impregnation resin mixture

The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidized halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.