Provided is an insulating varnish composition, including: two or more kinds of epoxy resins; and a filler having an average primary particle diameter of 500 nm or less, wherein the two or more kinds of epoxy resins contain 80 mass % or more of an epoxy resin having a number of repetitions of 0 in a molecular structural formula thereof with respect to a total mass of the two or more kinds of epoxy resins.

The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of the epoxy resin (A) is an epoxy resin (A-1) that is represented by formula (1) (wherein each R moiety independently represents a glycidyl group or a hydrogen atom, and at least two R moieties among the plurality of R moieties are glycidyl groups; and a represents the average of the number of repeating units, which is a real number within the range of from 0 to 30); and the compound (B) that has a phenolic hydroxyl group and the cationic photopolymerization initiator (C) have specific structures.

##STR00001##

The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of the epoxy resin (A) is an epoxy resin (A-1) that is represented by formula (1) (wherein each R moiety independently represents a glycidyl group or a hydrogen atom, and at least two R moieties among the plurality of R moieties are glycidyl groups; and a represents the average of the number of repeating units, which is a real number within the range of from 0 to 30); and the compound (B) that has a phenolic hydroxyl group and the cationic photopolymerization initiator (C) have specific structures.

##STR00001##

The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.

The present disclosure is related to an accelerator composition for the cure of polyfunctional isocyanates with epoxy resins comprising (a) a boron trihalide-amine complex, and (b) a quaternary ammonium or phosphonium halide as well as the use of such accelerator composition, cured isocyanate-epoxy resin products obtainable therefrom and a method of making a cured isocyanate-epoxy resin product.

Polyether-epoxide polymer compositions are disclosed. The compositions comprise a reaction product of a polyepoxide compound and a polyol composition comprising a polyether polyol. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.5:1 to 3:1. The polyether-epoxide composition has a T.sub.g within the range of −40° C. to 60° C. The polyether polyol has a hydroxyl value within the range of 150 to 800 mg KOH/g and an average hydroxyl functionality within the range of 3.5 to 8.0. In some aspects, the polyol composition further comprises a polyester polyol. Low- and elevated-temperature processes catalyzed by bases or Lewis acids for making the polyether-epoxide compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for coatings, elastomers, adhesives, sealants, and other valuable products is assembled from readily available starting materials without reliance on polyamines or polyisocyanates.

Embodiments of the present disclosure are directed towards directed towards heat curing compositions. The heat curing compositions can include an isocyanate component, wherein the isocyanate component includes an isocyanate-polyol reaction product, an epoxy material, and a Lewis acid-amine complex, wherein the heat curing composition has an isocyanate group to epoxide group ratio from 3:1 to 20:1.

Embodiments of the present disclosure are directed towards directed towards heat curing compositions. The heat curing compositions can include an isocyanate component, wherein the isocyanate component includes an isocyanate-polyol reaction product, an epoxy material, and a Lewis acid-amine complex, wherein the heat curing composition has an isocyanate group to epoxide group ratio from 3:1 to 20:1.

A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained. The two-composition polyether sealant system has good compatibility, greatly improves the adhesive properties thereof, achieves a good adhesion and waterproofing effect without needing to be used with a priming coating, and also avoids the risk of water leakage caused by misoperation in the applying of the priming coating existing in the prior art.

A low-modulus high-adhesion silane-modified polyether sealant for prefabricated buildings is provided by including a composition A and a composition B, wherein the composition A includes silane-modified polyether, plasticizer, hydroxy-terminated branched polyether, branched polyether epoxy resin, coupling agent, thixotropic agent, silica, reinforcing filler A, hollow glass microspheres and toner, and the composition B includes plasticizer, hydroxy-terminated branched polyether, light stabilizer, reinforcing filler B, organotin catalyst and amine curing agent. The present disclosure also optimized the various ingredients in the silane-modified polyether sealant, and a formulation of sealant having the best bonding effect was obtained. The two-composition polyether sealant system has good compatibility, greatly improves the adhesive properties thereof, achieves a good adhesion and waterproofing effect without needing to be used with a priming coating, and also avoids the risk of water leakage caused by misoperation in the applying of the priming coating existing in the prior art.