A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).

A curable thermosetting composition, comprising a capped poly(arylene ether) copolymer comprising a reactive end group, wherein the capped poly(arylene ether) copolymer is derived from an alkyl, aryl-phenol.

This disclosure relates to demulsifying polymers of Formula (I):

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demulsifier compositions containing the compound of Formula (I), and methods of using the polymers and compositions for separating water-in-oil emulsions.

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

A poly(arylene ether) copolymer wherein the poly(arylene ether) copolymer is a product of oxidative copolymerization of monomers comprising a first monohydric phenol; a second monohydric phenol different from the first monohydric phenol; a multifunctional phenol or polyphenol comprising a novolac, a dicyclopentadiene phenol novolac, or a combination thereof, and optionally, a trisphenol, wherein the functionality of the multifunctional phenol or polyphenol is greater than 2; and optionally, at least one terminal functional group.

A flame retardant with which fire retardancy is improved and the fire retardancy is able to be secured stably for a long time is provided. An internal layer 11 containing a polymer and a flame retardant factor layer 12 that is formed outside of the internal layer 11 and that contains a polymer to which at least one of a sulfonate group and a sulfonate base is bonded are included. Thereby, compared to a case that the flame retardant factor layer 12 is not included, moisture is hardly absorbed, and respective particles of the flame retardant are inhibited from being adhered to each other. Accordingly, blocking is inhibited.

Provided is a resin composition containing a resin (S) containing a polyarylene ether (A) modified with a functional group and a thermoplastic resin (B), and a carbon fiber (C).

A hydrogenated block copolymer is disclosed comprising a polymer block A and a polymer block B. Prior to hydrogenation, the polymer block A has a first vinyl aromatic compound, and the polymer block B contains monomers a) a styrene compound having a radical reactive group and b) at least one conjugated diene, and optionally (c) a second vinyl aromatic compound that is same or different from the first vinyl aromatic compound. The repeat units of monomer a) forms 10-80 wt. % of the total block copolymer, and 10-70 wt. % of the total weight of block B. After hydrogenation, the polymerized units derived from the monomer b) has a RU of 0-1.5 meq per gram of the hydrogenated block copolymer. The hydrogenated block copolymer exhibits reactivity and higher flow properties before curing, after curing, shows excellent mechanical properties, improved flame resistance, and good solvent resistance.

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

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