The present invention relates to a compression limiter made of a first thermoplastic composition comprising a semi-crystalline semi-aromatic polyamide. The invention further relates to a process for producing the compression limiter, and to an assembly comprising the compression limiter and a thermoplastic body made of a second thermoplastic polyamide composition. According to the invention, the compression limiter is made of a thermoplastic composition.

The present invention relates to a polymer film (P) containing a polyamide composition (PC) that comprises an amorphous polyamide (A) and a semicrystalline polyamide (B) and to a method for producing the polymer film (P). The present invention further relates to a method for packaging food products with the polymer film (P).

Provided is a polyamide resin having a high glass transition temperature and a low water absorption rate and from which a molded article that exhibits minimal deformation after water absorption is obtained. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units. More than 30 mol% of the diamine-derived structural units are derived from a diamine represented by the following formula, and more than 30 mol% of the dicarboxylic acid-derived structural units are derived from an aromatic dicarboxylic acid:

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Provided is a polyamide resin having a low mass loss at a temperature slightly higher than the melting point. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units, and of the diamine-derived structural units, from 70 to 97 mol % are derived from p-benzenediethanamine and from 3 to 30 mol % are derived from a diamine represented by formula (1). 50 mol % or more of the dicarboxylic acid-derived structural units are derived from an aromatic dicarboxylic acid.

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Provided are a polyamide resin having high crystallinity, a high glass transition temperature, and a low mass loss rate, and a polyamide resin composition and a molded article in which the polyamide resin is used. The polyamide resin includes a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, in which 50 mol % or more of the diamine-derived structural units are structural unit derived from p-benzenediethanamine, and of the dicarboxylic acid-derived structural units, from not less than 20 mol % to less than 95 mol % are structural units derived from an aromatic dicarboxylic acid and from more than 5 mol % to not more than 80 mol % are structural units derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 15 carbons.

The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.

To provide a semi-aromatic polyamide resin composition having excellent good plating properties, low water absorption properties, and solder reflow resistance. A semi-aromatic polyamide resin composition of the present invention comprises: 10 to 200 parts by mass of an inorganic filler (B) and 2 to 30 parts by mass of a toughness improver (C) based on 100 parts by mass of a semi-aromatic polyamide (A), wherein the semi-aromatic polyamide resin (A) satisfies the following (a) and (b): (a) a melting point (Tm) measured by differential scanning calorimetry (DSC) is 280° C. or higher; and (b) an equilibrium water absorption rate at 80° C. and 95% RH is 3.5% or less.

The embodiments provide a polyamide-based film, which comprises a polyamide-based polymer and has a light resistance index of 0.660 GPa-1 or less as represented by the following Equation 1, whereby it has excellent mechanical properties, optical properties, and light resistance. [Equation 1] Light resistance index=ΔYI/Y. In Equation 1, Y is the modulus of the film, and ΔYI is the rate of change in yellow index (YI) of the film before and after a light resistance test in which UV rays are irradiated to the film at 60° C., the UV irradiation is stopped, and water is sprayed at 50° C.

The present application relates to fibers having a diameter of 1 nm to 10,000 nm, of one or more biocompatible polymers, wherein the polymers have a backbone which includes a positively charged component from a zwitterionic moiety. Additionally, this application discloses an implantable therapeutic delivery system and its method of formation, comprising a housing defining a chamber, wherein said housing is porous and formed from the fibers. Inside of the housing includes a preparation of cells which release a therapeutic agent from the chamber. The implantable therapeutic delivery system can be used in the treatment of diabetes.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)