The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.

The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.

A paving binder according to the present invention is used for a paving mixture for forming a pavement, including a polyamide resin having a weight average molecular weight, as measured by gel permeation chromatography of 2,000 or more and 10,000 or less and having an area, corresponding to a component having a molecular weight of 20,000 or more and 500,000 or less, of 0.5% or more and 12% or less of a total area in a chromatogram of molecular weight distribution as measured by gel permeation chromatography. Thus, tolerance for a severe temperature condition or loading condition can be improved, while ensuring convenience from the standpoint of laying such that the laying can be made by the conventional machine composition or laying system.

A paving binder according to the present invention is used for a paving mixture for forming a pavement, including a polyamide resin having a weight average molecular weight, as measured by gel permeation chromatography of 2,000 or more and 10,000 or less and having an area, corresponding to a component having a molecular weight of 20,000 or more and 500,000 or less, of 0.5% or more and 12% or less of a total area in a chromatogram of molecular weight distribution as measured by gel permeation chromatography. Thus, tolerance for a severe temperature condition or loading condition can be improved, while ensuring convenience from the standpoint of laying such that the laying can be made by the conventional machine composition or laying system.

Described herein is a polyamide composition and a tubular or pipe multilayer structure including the same.

A corrosion inhibitor has a film-forming portion. In one embodiment, the corrosion inhibitor further includes a surfactant, a coupling solvent and a carrier solvent. In another embodiment, the corrosion inhibitor has a film-forming portion that includes at least two multi-dentate compounds and a compound having a single active group. Each of the multi-dentate compounds and the compound having a single active group are selected from the group consisting of compounds having nitrogen-containing polar groups, compounds having acid groups and combinations thereof.

A corrosion inhibitor has a film-forming portion. In one embodiment, the corrosion inhibitor further includes a surfactant, a coupling solvent and a carrier solvent. In another embodiment, the corrosion inhibitor has a film-forming portion that includes at least two multi-dentate compounds and a compound having a single active group. Each of the multi-dentate compounds and the compound having a single active group are selected from the group consisting of compounds having nitrogen-containing polar groups, compounds having acid groups and combinations thereof.

The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan δ of not more than 8.30×10−3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan δ of not more than 8.30×10−3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

Polymers are disclosed that incorporate portions of secondary or tertiary polyamide segments connected with polyisocyanates. These polymers have enhanced matting properties. The enhanced matting properties are from creating an inherently matt surface from the polymer without the use of any separate fine particle size matting additives. Conventional matting agents such as fine particle size silica usually results in loss of physical properties such as haze development and porosity in the coating from the matting agent. Composites and hybrids of these polymers and other polyamides, polyurethane with vinyl polymers (acrylates) are also disclosed and claimed.