Described herein is a copper electroplating composition including copper ions, an acid, and at least one polyaminoamide including a group of formula L1

[B-A-BZ].sub.n[YZ].sub.m(L1)

that is obtainable by reacting a diamine compound including two primary or secondary amino groups with an amino acid in a molar ratio of approx. 1:2 to form an aminoamide compound that is afterwards reacted with a coupling agent and optionally with a diamine co-monomer.

The invention relates to a process for manufacturing wet strength resins, which process comprises a polyamide reactor for amidation, an EHH reactor for epihalohydrin addition, a maturing tank for maturing, a ring-closure and cross-linking reactor for polymerization, and in the process a reaction mixture containing at least EHH and at least polyaminoamide epihalohydrin adduct is manufactured. The process further comprises between the maturing tank and the ring-closure and cross-linking reactor a membrane unit comprising a membrane for dividing the reaction mixture stream from the membrane unit into two streams: a permeate stream comprising un-reacted epihalohydrin and a reject stream comprising EHH/PAIM adduct guided to the ring-closure and cross-linking reactor.